Hysol KL1000-3A | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Hysol KL1000-3A | Black Epoxy Mold Compound

KL1000-3A Cheap Black Epoxy Mold Compound Mini Pellets

Main features

Lowest Cost of Ownership
Excellent Moldability
Designed for ZIP, SIL, DIP packages

Product Description

Hysol KL1000-3A is a black, semiconductor grade epoxy molding compound. It provides the lowest cost of ownership for an epoxy molding compound. It works on easy, low-end discrete semiconductor packages for companies that still use halogen-containing epoxy molding compounds.

Hysol KL1000-3A has a history that predates the acquisition of Huawei Electronics by Henkel. In 2005, Henkel formed a joint-venture with HuaweI Electronics in China to create Henkel Huawei Electronics (HHE) in Lianyungang China. HHE made low-end, halogen containing epoxy molding compounds that used Bromine or Antimony as a flame retardant. The KL1000-3A is an old product that is still made at Hysol Huawei today.

Hysol KL1000-3A is a halogen containing, legacy product that has been used for decades with great success for bridge rectifiers, PDIP and low end packages such as Zig zag In line (ZIP), Single In Line (SIL), Dual In line (DIP) and other low end semiconductor discrete Packages.

Product Family
KL1000-3A

1. Select Product Form

Pellet

2. Available Pellet Size

14 mm 55 mm

3. Available Pellet Weight

6.0 gr 100 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

75 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

2.0

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	365 days

Physical Properties

Spiral Flow @ 175°C

80 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	7 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	3 ppm

Moisture absorption

0.20 %

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	1300 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	14.5 N/mm2

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

3.5x10¹⁶ Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	25 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	77 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	23 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

165 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

1.3 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F (Automold)	50 - 80 s
Curing Time @ 175°C / 347°F (Conventional Mold)	50 - 120 s
Mold Temperature	150 - 195 °C
Preheat Temperature	80 - 90 °C

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	2 - 6 hrs

Transfer Pressure

40 - 100 kg/cm2

Transfer Time

10 - 18 s

Additional Information

Technical Specifications

Short Description of Hysol KL1000-3A | Black Epoxy Mold Compound
Typical applications and uses of Hysol KL1000-3A \| Black Epoxy Mold Compound include: ZIP packages SIL packages DIP packages Other low-end discrete components Technical Datasheets for Hysol KL1000-3A \| Black Epoxy Mold Compound TDS (English) Click to access Hysol KL1000-3A \| Black Epoxy Mold Compound Technical Data Sheet *Note that only registered users may access technical datasheets

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