Hysol MG33F-0659 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Hysol MG33F-0659 | Black Epoxy Mold Compound

Hysol MG33F-0659 Black Epoxy Mold Compound for Tantalum Capacitors

MG33F-0659 Black Epoxy Mold Compound for Tantalum Capacitors

Main features

Automold Tantalum capacitors
Low moisture absorption
High moldability and fast cycle time

Product Description

Hysol MG33F-0659 is a black, semiconductor-grade epoxy molding compound (duroplast) designed for the encapsulation and protection of tantalum capacitors and surface mount resistors. Because of its fast cure, it is also very well suited for the manufacture of reed relays.

Hysol MG33F-0659 has a filler weight of 75% and is formulated with a short gel time to make it useful for the production of (Ta) Tantalum capacitors through automolding processes. It is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant and meets UL 94 V-0 Flammability at 6.35mm thickness.

Typical applications:

Tantalum capacitors
Reed relays
Aluminum housed resistors (Check why MG33F-0659 is suitable for this application)

Features:

Fast cured formulation (Check the curing conditions)
Long spiral flow to provide best moldability and wide molding latitude
Great adhesion to copper substrates and CTE matched with Al
High thermal stability (High Tg and low stress )
Low mold shrinkage (0.16%) for large components molding

Product Family
MG33F-0659

1. Select Product Form

Pellet

2. Available Pellet Size

14 mm

3. Available Pellet Weight

6.1 gr

4. Available Package Size

15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

In stock

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

76 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.83

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	210 days

Physical Properties

Spiral Flow @ 175°C

66.04 cm

Chemical Properties

Moisture absorption

0.45 %

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	14710 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	137 N/mm2

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C	85

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

3.0x10¹⁵ Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	18 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	60 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	14 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

175 °C

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F (Automold)	50 - 70 s
Curing Time @ 175°C / 347°F (Conventional Mold)	70 - 90 s
Mold Temperature	140 - 180 °C
Preheat Temperature	80 - 95 °C

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	2 - 6 hrs

Transfer Pressure

40 - 85 kg/cm2

Transfer Time

6 - 15 s

Additional Information

MG33F-0659 Epoxy Mold Compound for Aluminum Housed Resistors

Hysol MG33F-0659 is formulated based on MG33-0690, which is a industrial proven product for aluminum housed resistors encapsulation. They have pretty similar properties. You could check the properties comparison table below. Two extra advantages of MG33F-0659 are:

(1) MG33F-0659 contains green flame retardants and meet UL90 V-0 flammability @1/4 inches, which MG33-0690 does not have.
(2) MG33F-0659 has lower mold shrinkage than MG33-0690.

In conclusion, Hysol MG33F-0659 is a good alternative to MG33-0690 for aluminum housed resistor application.