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Hysol MG33F-0659 is a black, semiconductor-grade epoxy molding compound (duroplast) designed for the encapsulation and protection of tantalum capacitors and surface mount resistors. Because of its fast cure, it is also very well suited for the manufacture of reed relays.
Hysol MG33F-0659 has a filler weight of 75% and is formulated with a short gel time to make it useful for the production of (Ta) Tantalum capacitors through automolding processes. It is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant and meets UL 94 V-0 Flammability at 6.35mm thickness.