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Hysol MG33F-0659 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Automold Tantalum capacitors
  • Low moisture absorption
  • High moldability and fast cycle time

Product Description

Hysol MG33F-0659 is a black, semiconductor-grade epoxy molding compound (duroplast) designed for the encapsulation and protection of tantalum capacitors and surface mount resistors. Because of its fast cure, it is also very well suited for the manufacture of reed relays. 

Hysol MG33F-0659 has a filler weight of 75% and is formulated with a short gel time to make it useful for the production of (Ta) Tantalum capacitors through automolding processes. It is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant and meets UL 94 V-0 Flammability at 6.35mm thickness.

 

Curing Time

  • 70 to 90 seconds @175°C (Conventional)
  • 50 to 70 seconds @175°C (Automold)

Post Cure

  • 2 to 6 hours @175°C
Product Family
MG33F-0659  
Pellet
14 mm
5 gr 6.1 gr
10 kg 15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Black
Filler Content 76 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.83
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 210 days
Chemical Properties
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 168h @ 85ºC | 85% RH 0.45 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 14710 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 137 N/mm2
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds 85
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 3.0x1015 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 18 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 60 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 14 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 175 °C
Spiral Flow
Spiral Flow @ 175°C 66.04 cm
UL94 Rating
UL94 @ 1/4 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F (Automold) 50 - 70 s
Curing Time @ 175°C / 347°F (Conventional Mold) 70 - 90 s
Mold Temperature 140 - 180 °C
Preheat Temperature 80 - 95 °C
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 6 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 2 - 6 hrs

Additional Information

MG33F-0659 Epoxy Mold Compound for Aluminum Housed Resistors