Hysol MG33F-0661 | Gold Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Main features

Environment friendly molding compound
Very low moisture absorption
Identical to MG33F-0660

Product Description

Hysol MG33F-0661 is a gold, semiconductor-grade epoxy molding compound or duroplast designed for the encapsulation and protection of tantalum capacitors. Because of its fast cure, it is also very well suited for the manufacture of reed relays.

Hysol MG33F-0661 was formulated with a short gel time to make it useful for automolding tantalum capacitors and reed relays.It is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant. MG33F-0661 molding compound was developed specifically for the encapsulation of tantalum capacitors in automold applications. MG33F-0661 meets UL 94 V-0 Flammability at 6.35mm thickness.

You might be wondering, "But what's the difference between this one and MG33F-0660?" Short answer. Nothing. Back in the day, SKUs were not ideal so this is a customer specific SKU for the exact same product. Why is this here then? Maybe you ARE that customer looking for it. You are welcome.

Product Family
MG33F-0661

1. Select Product Form

Pellet

2. Available Pellet Size

14 mm

3. Available Pellet Weight

5.3 gr

4. Available Package Size

10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications

Technical Specifications

General Properties

Color

Color
The color

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.81

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days

Physical Properties

Spiral Flow @ 175°C

27 cm

Chemical Properties

Moisture absorption

0.42 %

Electrical Properties

Dielectric Constant Dielectric Constant Dielectric Constant (k), commonly known as relative permittivity, is a number relating the ability of a material to carry alternating current to the ability of vacuum to carry alternating current. It determines the ability of an insulator to store electrical energy and is the ratio of electric permeability in vacuum against the electric permeability of a material. The lower the dielectric constant (κ) and dissipation factor, the less energy is absorbed from an electric field, making it a much better insulator. It is a dimensionless property that can be affected by various factors such as the thickness uniformity of a material, insufficient contact between the sample and electrodes, water adsorption and contact resistance.
Dielectric Constant @ 23 ˚C/1 kHz	4.1
Dielectric Constant @ 23 ˚C/100 kHz	4.0

Dielectric Strength

Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.

Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.

As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.

37 kV/mm

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

2.6x10¹⁵ Ohms⋅cm

Dissipation Factor Dissipation Factor Dissipation factor is commonly known as loss tangent or tan delta.   It is a ratio of the loss index and the relative permittivity and it measures the inefficiency of an insulating material to maintain energy (that otherwise dissipates in the form of heat). The lower the factor, the better the insulation. It is the reciprocal of the quality factor and always refers to a specific temperature and frequency.
Dissipation Factor @ 23°C /1 kHz	0.004
Dissipation Factor @ 23°C /100 kHz	0.010

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	22000 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	20 N/mm2

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C	85

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	18 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	60 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	22 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

164 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.8 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F (Automold)	60 - 90 s
Mold Temperature	170 - 190 °C
Preheat Temperature	80 - 90 °C