LINQSOL EMC-5013 | Thermally conductive Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LINQSOL EMC-5013 | Thermally conductive Epoxy Mold Compound

Main features

Green epoxy molding compound
Thermally conductive molding compound
Designed for transistor outline (TO) and fullpack power packages

Product Description

LINQSOL EMC-5013 is a thermally conductive epoxy molding compound specifically developed for the encapsulation of transistor outline (TO) such as TO220F, TO3PF and fullpack packages power packages. Its low porosity and thermal conductivity of >2 W/m·K satisfies the heat dissipation required by high performance power packages.

LINQSOL EMC-5013 has good electrical performance for packages requiring insulative property. Additionally, with a UL 94 V-0 flammability rating and low water absorption, EMC-5013 guarantees strong performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOL EMC-5013 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

Product Family
EMC-5013

1. Select Package Type

1kg box 15kg box

2. Available Product Form

Powder Pellet

3. Available Pellet Size

— mm 58 mm

4. Available Pellet Weight

— gr 143 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

2.17

Shelf Life
Shelf Life @ 5°C	183 days

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

178 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

2.3 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	20 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	55 ppm/°C

Gel Time
Gel Time @ 175°C / 347°F	32 s

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

7.0x10¹⁵ Ohms⋅cm

Water Extract Data
Conductivity	0.04 mmhos/cm

Dissipation Factor
Dissipation Factor @ 25°C /1000 kHz	0.009

Dielectric Constant
Dielectric Constant @ 25 ˚C/1000 kHz	4.2

Mechanical Properties

Water Extract Data
pH of extract	5.5

Flexural Modulus
Flexural Modulus @ 25°C	20.5 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	148 N/mm2

Chemical Properties

Moisture absorption

0.32 %

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	9 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	6 ppm

Curing Conditions

Transfer Pressure

40-90 kg/cm2

Transfer Time

17-25 s

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	6-8 hrs

Curing Schedule
Curing Time @ 175°C / 347°F	120-150 s
Mold Temperature	170-190 °C

Physical Properties

Spiral Flow @ 175°C

60 cm

Additional Information

Property	Value	Unit
General Properties
Resin type	OCN/Low Stress	–
Filler sieving size	180	µm
Specific gravity	2.17	–
Spiral flow at 175°C	60	cm
Bleed Length at 175°C	≤2.0	mm
Chemical Properties
Ion content Chloride (Cl–) concentration Sodium (Na+) concentration	9 6	ppm ppm


Water absorption (PCT 24hr)	0.32	%
pH of extract	5.5	–
Electrical conductivity of extract	40	µS⋅cm–1
Electrical Properties
Dielectric constant at 1MHz	4.2	-
Dissipation factor at 1MHz	0.009	-
Volume resistivity at 25°C	7×10¹⁵	Ω⋅cm

Processing Instructions

Before use, let LINQSOL EMC-5013 compounds reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
Use the materials within 72 hours after removing the container from cold storage.

Storage and Handling

LINQSOL EMC-5013 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.