LINQSOL EMC-G135 | Thermally Conductive Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Green epoxy molding compound
  • Low cost thermally conductive molding compound
  • Designed for rectifier bridges and SMX packages

Product Description

LINQSOL EMC-G135 is a green epoxy molding compound specifically developed for rectifier bridges (GBU, KBJ, GBS and etc.) and SMX packages. It offers good moldability and low modulus to meeting low-stress requirements. With a thermal conductivity of ~1.7W/m⋅K, it satisfies the heat dissipation required by high-performing packages. G135 boasts of its high-cost effectiveness and excellent workability with more than 500 continuous mold shots. 

LINQSOL EMC-G135 guarantees strong performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOLTM EMC-G135 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

Key Features

  • ~1.7 W/m·K thermal conductivity — Enhances heat spreading in high-current bridge rectifiers.
  • Low modulus (~16 GPa) — Reduces package stress and risk of crack/warp during cycling.
  • High moldability (spiral flow ~88 cm) — Fills complex cavities cleanly; supports small gates and long runners.
  • 500+ continuous shots — Stable release and low bleed for fewer interruptions and lower scrap.
  • Electrical cleanliness (Cl⁻ ~9 ppm, Na⁺ ~4 ppm) — Minimizes ionic pathways that can lead to leakage or corrosion.
  • Low moisture uptake (~0.45% PCT 24 h) — Helps maintain insulation and dimensional stability.
  • UL-94 V-0 flammability — Meets stringent safety requirements for power electronics.
  • RoHS/REACH compliant — Free from substances of concern for global market access.

Reliability Tests Passed:

  • HTRB, Tₐ=125°C, V=80%VR * 500 hour
  • PCT, Tₐ=121°C, P=0.215atm, RH=100%* 98 hours
  • Thermal Cycling Test, -55°C - +150°C * 500 cycles

Application/Suitable For:

  • Bridge rectifier packages: GBU, KBJ, GBS; SMX packages
  • AC/DC power supplies, chargers, UPS rectifier stages
  • Motor drives and industrial controls (bridge diode modules)
  • General power conversion, where thermal conductivity and low package stress are critical

 

Product Family
EMC-G135  
15kg box
Pellet
58 mm
143 gr

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Black
Filler Content 76.5 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 2.0
Shelf Life
Shelf Life @ 5°C 183 days
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 160 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 1.7 W/m.K
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
 V-0
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 25 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 75 ppm/°C
Gel Time
Gel Time @ 175°C / 347°F 25 s
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 6.0x1015 Ohms⋅cm
Water Extract Data
Conductivity 34 mmhos/cm
Dissipation Factor
Dissipation Factor @ 25°C /1000 kHz 0.008
Dielectric Constant
Dielectric Constant @ 25 ˚C/1000 kHz 4.1
Mechanical Properties
Water Extract Data
pH of extract 5
Flexural Modulus
Flexural Modulus @ 25°C 16000 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 145 N/mm2
Chemical Properties
Moisture absorption 0.45 %
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 9 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 4 ppm
Physical Properties
Spiral Flow @ 175°C 88 cm
Curing Conditions
Transfer Pressure 40-70 kg/cm2
Transfer Time 17-25 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 6-8 hrs
Curing Schedule
Curing Time @ 175°C / 347°F 120-150 s
Mold Temperature 170-190 °C

Additional Information

 Processing Instructions

  • Before use, let LINQSOL EMC-G135 reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination. 

  • Use the materials within 72 hours after removing the container from cold storage.

 

Storage and Handling

 LINQSOL EMC-G135 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life at 5 °C is 183 days. 

 

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.