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LOCTITE ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimise stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes and metal substrate types.
LOCTITE ABLESTIK 2030SCM is a silver filled, low stress, snap curable hybrid product that is low in halogen content and complies with the IPC/JEDEC J-STD-709 low halogen electronic products standard.