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LOCTITE ABLESTIK 2053S is a polymer filled, hybrid non conductive die attach adhesive with low warpage, high adhesion, low stress and low moisture uptake, designed for use in array packaging. It exhibits great optical performance, complimented by high transmittance, high Optical density and HRI and good adhesion to various interfaces such as EMC, engineering plastic, glass and metals. It is a low modulus, chip bonding, die attach paste for larger die size that works, among others, for chip bonding on FR4 substrates.
LOCTITE ABLESTIK 2053S offers relatively high thermal conductivity with stable optical performance, good temporary bonding and minimal shift and tilt post reliability. It has been successfully used for the ASIC (Application Specific Integrated Circuit) attach of optical sensors, as a receiver Die attach for 3d sensing modules.