LOCTITE ABLESTIK 566K
- Extremely flexible film
- Bond disimilar materials
- Thermally conductive
LOCTITE ABLESTIK 566K is a white, heat curable epoxy film, designed for bonding disimilar materials with mismatched coefficients of thermal expansion. It is electrically insulating, extremely flexible and cures in a low temperature
LOCTITE ABLESTIK 566K is a low temperature cure version of LOCTITE ABLESTIK 561K adhesive. It is mainly used for heat sink assembly and has a glass fabric carrier.
- 2 hours @ 100°C
| Work life @25°C |
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
| Volume Resistivity |
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
| Thermal Conductivity |
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
How does ABLESTIK 566K compare to ABLESTIK 561K?
The storage temperature of both materials is as low as -40 °C to guarantee its material properties over a longer range of time.
The 561K is a great reference material that can be stored at -40 °C for 12 months but can also be stored at ambient (25 °C) for up to 6 months without loss of performance.
The difference with 561K however, in the higher minimum cure schedule of 125 °C for 2 hours.
The 566K material can cure at 100 °C but this is achieved by an increased catalyst load making the material more reactive, giving it shorter shelf life. (We would expect -20 °C storage to be sufficient for the 566K for 3-6 months)
Essentially you end up with two options:
- Use 561K with 6 months storage at 25 °C and accept a higher 125 °C cure
- Use 566K with 3-6 months storage at -20 °C and cure at 100 °C