Product Description
LOCTITE ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe.
LOCTITE ABLESTIK 84-1LMI is an electrically conductive, silver filled adhesive with low bleed and low outgassing that meets the requirements of MIL-STD883, Method 5011.
Cure Schedule
- 1 hour @ 150°C
- 2 hours @ 125°C