Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE ABLESTIK 84-1LMI epoxy die attach adhesive is designed for microelectronic chip bonding applications. This rigid adhesive is ideal for application by automatic dispenser or hand probe. It can be used on Noble metals and offers excellent mechanical and chemical strength.
LOCTITE ABLESTIK 84-1LMI is a highly electrically conductive, silver filled adhesive with low bleed and low outgassing that meets the requirements of MIL-STD883, Method 5011. This product long work life and high reliability across industries and is typically used for component and die attach for the military, automotive, industrial and semiconductor sector. Its operating temperature is -40 up to 150°C.