LOCTITE ABLESTIK 84-1LMISR4

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features

Excellent dispense capabilities
Stencil printable
Bare Copper Substrate

Product Description

LOCTITE ABLESTIK 84-1LMISR4 electrically conductive, halogen free, die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems.

LOCTITE ABLESTIK 84-1LMISR4 is a manufacturer's product of choice, can be used for LED applications and like most epoxies it is suitable for bare Copper substrates and small die sizes. Interested in higher conductivity? Then you might want to consider 8060T or even 8064T for larger dies.

LOCTITE ABLESTIK 84-1LMISR4 can be applied by stamping, stencil or dispensing and it should present sufficient stiffness to allow wire bonding. Its unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.

Cure Schedule

1 hour @ 175°C

Product Family
84-1LMISR4

1. Select Package Type

Syringe (Blue Tip)

2. Available Package Size

3 cc 5 cc

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Density (g)

3.5 g/cm3

Work life @25°C

Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.

18 hours

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C	365 days

Physical Properties

Thixotropic index

Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.

5.6

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

8,000 mPa.s

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	20 ppm
Potassium (K+) Potassium (K+) The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)	10 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	10 ppm

Moisture absorption

0.6 %

Water Extract Conductivity

≤2.0 Ohm

Mechanical Properties

Shear strength
Shear Strength @25°C	19.6 N/mm2
Shear Strength @250°C	0.29 N/mm2

Tensile Modulus Tensile Modulus Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading. It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed. Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @-65°C	4,400 N/mm2
Tensile Modulus @150°C	2,000 N/mm2
Tensile Modulus @25°C	3,900 N/mm2
Tensile Modulus @250°C	300 N/mm2

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	40 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	150 ppm/°C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

120 °C

Specific Heat Capacity

Specific Heat Capacity
Specific heat capacity is the amount of heat energy required to raise the temperature of a substance per unit of mass. The specific heat capacity of a material is a physical property. It is also an example of an extensive property since its value is proportional to the size of the system being examined.

0.7 J/(g⋅°C)

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

2.5 W/m.K

Additional Information

DMA Curve of 84-1LMISR4

Can I cure 84-1LMISR4 at 120°C?

We have been discussing the possibility to cure 84-1LMISR4 at 120 °C with multiple Henkel applications engineers and we do not recommend this approach as it is very risky. The official Henkel recommendation is a minimum cure temperature of 125 °C.

We fear that a combination of an SR4 batch with relatively low reactivity (but within spec), and a cool spot in the curing oven might occasionally fail to “kick-off” the curing reaction.

The syringe size limits me due to the pot life. What can I do?

If you are worried about waste because the equipment can only use X grams of glue in an 8-hour shift, then it may be possible to buy some empty syringes/piston kits from Nordsen/EFD and transfer part of the adhesive from the larger syringe into an empty syringe. It requires a “tip-to-tip” adaptor (which can be washed & re-used), an airline with a regulator, and takes only a couple of minutes. This way you can "ration" the product without too much waste.