Specialty Chemicals, Adhesives & Plastics
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LOCTITE ABLESTIK 84-1LMISR4 electrically conductive, halogen free, die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems.
LOCTITE ABLESTIK 84-1LMISR4 is a manufacturer's product of choice, can be used for LED applications and like most epoxies it is suitable for Copper substrates. Interested in higher conductivity? Then you might want to consider 8060T or even 8064T for larger dies.
LOCTITE ABLESTIK 84-1LMISR4 can be applied by stamping or dispensing and it should present sufficient stiffness to allow wire bonding. Its unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.
We have been discussing the possibility to cure 84-1LMISR4 at 120 °C with multiple Henkel applications engineers and we do not recommend this approach as it is very risky. The official Henkel recommendation is a minimum cure temperature of 125 °C.
We fear that a combination of an SR4 batch with relatively low reactivity (but within spec), and a cool spot in the curing oven might occasionally fail to “kick-off” the curing reaction.
If you are worried about waste because the equipment can only use X grams of glue in an 8-hour shift, then it may be possible to buy some empty syringes/piston kits from Nordsen/EFD and transfer part of the adhesive from the larger syringe into an empty syringe. It requires a “tip-to-tip” adaptor (which can be washed & re-used), an airline with a regulator, and takes only a couple of minutes. This way you can "ration" the product without too much waste.