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LOCTITE ABLESTIK 84-1LMISNB electrically conductive adhesive is designed for semiconductor packaging applications. This halogen free, heat curable adhesive is filled with silver and has high purity. Its poisson's ration, as with the majority of adhesives is 0.33.
LOCTITE ABLESTIK 84-1LMISNB meets the requirements of MIL-STD-883, Method 5011.
Density is typically stated for the wet state of the material. Cured density for die attach materials will be a few % higher but this is not a value that we measure.
Generally, uncured (wet state) density is important for calculating usage while cured density is important for running modelling based on thermo-mechanical properties.
84-1LMI series are all “solvent free” so the weight loss on cure is small, and therefore the change in density during cure is also small.