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LOCTITE ABLESTIK CE3920 is designed for dispense or printing applications and SMT assembly processes. This heat curable epoxy adhesive is mainly used for SMD interconnect formations, lid attach and cap attach assembly applications. One property that really stands out is its very high Ionic Purity.
LOCTITE ABLESTIK CE3920 is a one component, electrically conductive lead free alternative to solder. It has low viscosity and low CTE while also requiring no post cure. Its long work life minimizes product waste and clean-up time, providing increased production efficiency.