LOCTITE ABLESTIK ICP 2120

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

conductive adhesive for compact camera modules

Main features

CCM bracket grounding
50°C Cure temp
High thermal conductivity

Product Description

LOCTITE ABLESTIK ICP 2120 silver filled silicone MS polymer is developed for conductive bonding in high-volume consumer devices (curing at 50° Celsius and lower by moisture) . It shows excellent adhesion in interfaces such as SUS and Nickel.

LOCTITE ABLESTIK ICP 2120 displays excellent DCR and VR performance. It has a very high thermal conductivity (7 W/mK) and low tensile modulus. This silicon adhesive is used for low temp/moisture curable application for CCM bracket grounding.

LOCTITE ABLESTIK ICP 2120 is a low modulus ECA which will cure at temperatures between 25°C and 50°C by moisture and or heat. As such it can be a good option for battery applications requiring a maximum of 60°C curing temperature.

Cure Schedule

30min @ 50°C

Specifications
Additional Information

Technical Specifications

General Properties

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C	365 days

Physical Properties

Thixotropic index

Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.

2.5

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

28,000 mPa.s

Thermal Properties

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

7 W/m.K

Additional Information

LOCTITE ABLESTIK ICP is an electrically-conductive adhesive (ECA) designed to for use with heat-sensitive components often found within compact camera module (CCM) structures for mobile devices. The room temperature, moisture cure capability of the material protects delicate substrates, while providing excellent electrical conductivity, low direct contact resistance (DCR) and good dispensing performance for high-volume production environments.

Enables high yield and mass production of production of thin, delicate, heat-sensitive devices
Facilitates robust CCM operation with excellent electrical grounding performance and protection against ESD
High reliability electrical and thermal performance
Highly stable for production adaptability