Specialty Chemicals, Adhesives & Plastics
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LOCTITE ABLESTIK QMI538NB is a PTFE filled non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. This low modulus (100MPa) product is used for MEMS and die stacking, with NB standing for No Bleed.
LOCTITE ABLESTIK QMI538NB is a hydrophobic BMI Hybrid product that offers low viscosity and reduced resin bleed, along with stability at higher temperatures. With its excellent adhesive strength and good popcorning resistance after solder reflow temperatures it is typically used on solder resist, flexible tapes and on bare siliconE and die passivation.
QMI538NB is a lower modulus alternative of QMI536NB for MEMS and die stacking from the beginning.