Power systems
| Thermal insulator pads |
Key considerations: - High power/High Voltage
- Reinforced with fiberglass
- High Breakdown Voltage
- Resist tear, puncture & cut-through
- Stencil printable or pre-applied
|
TIP 3500, TIP5000 |
| Phase change materials |
Key considerations: - High power applications
- Fill thin bondlines (less than 0.1mm)
- High thermal conductivity & stability
- Superior reliability & no pump out
- Stencil printable or pre-applied
|
PTM 7000, PTM 7950 |
| Thermal Gap fillers |
Key considerations: - Able to fill 0.1mm - 5mm gaps
- Dissipate heat (more than 3 W/mK)
- Soft. Able to relieve mechanical stress
- Custom sizes are desirable
- Will be applied on an automated line
|
TGP 3000, TGP 6000, HT3500, HLT7000 |
These pads need to be capable of withstanding high power and high voltage applications. Fiberglass is commonly used for protection and a high breakdown voltage is needed for isolation. These materials must be tear, puncture and cut through resistant and should be applied either by stencil print or pre-applied.
Two insulator pads that are commonly used for Solar applications are:
Solar applications require phase change that can be used for high power applications. The major requirement is the ability to fill bondlines that are thinner than 0.1mm while retaining low thermal impedance and stability. These materials need to display high reliability and minimal to no pump out.
Some phase change materials that are used for Solar power systems are:
Thermal Gap fillers
Gap fillers are either liquid or pad materials that must be able to effectively dissipate heat while also be soft to relieve mechanical stresses. These materials should be able to fill a wide range of gaps (ranging from 0.1mm to 5mm) and typically come in custom sizes that can be applied to automatic processes.
Some thermal gap pads and liquid hybrid fillers that are used for Solar power systems are:
Gap Pads
Liquid Hybrids
| Potting Encapsulants |
Key considerations: - Thermally Conductive over 1 W/mK
- Low stress for low shrinkage
- Low CTE post curing
- Low Viscosity
- Electrical insulation & Flame retardant
|
SI5140, SI5145, 2850FT, U2500 |
| Conformal coating |
Key considerations: - Stress relief in Thermal cycling/Shock
- Range of viscosities
- Low modulus
- Low Coefficient of thermal expansion
- Moisture and chemical resistance
|
SI 5293, PC18M |
These materials are typically used for power storage and single/three phase inverters. They need to have basic thermal conductivity but more crucially we want to control their stress properties. Low shrinkage and low CTE post curing are needed. Low viscosity is also important so that the material can flow everywhere within the package. Liquid encapsulants need to be electrically insulating to avoid any shorts and flame retardant to ensure safety and reliability. Main three chemistries and recommended products are:
Silicones:
Epoxies:
Urethanes:
Conformal coatings
Conformal coating ensures stress relief during and after thermal cycling and thermal shock. They need to have a wide range of viscosities that can be used for various applications. These coatings are usually jettable and need to be soft with low modulus and CTE that will protect the surface of the package without affecting it. Moisture and chemical resistance is also crucial.
Silicones:
Urethane Acrylates:
