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HT3500 silicone based one-part Gap Filler provides a thermal conductivity of 3.5 W/mK along with high conformability and high compressibility. It is formulated to deliver high dispense rates for improved productivity, long-term reliability performance and easy reworkability.
HT3500 is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost. The minimum bondline thickness that it can reach is 0.1mm with a Thermal Impedance of 0.4. Additionally it performs great in oil,crack and slump testing and it exhibits no pump out and cracking risk.