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TC-7600H-BDF | Black Optical Molding Compound

Main features

High performance
Fine pitch RGB
Black with wet method

Product Description

TC-7600H-BDF is a high-performance, black coloured, optically clear epoxy developed for small space RGB applications. This single component epoxy exhibits excellent adhesion and stability at high temperature that helps achieve great package performance and long life. It works very similar, if not better than XX600H product types.

TC-7600H-BDF gets its black colour not by powder mixing but with a wet method . This low stress, led encapsulation epoxy passes TCT, PCT and moisture reliability testing on EMC1010 package standard. It is a reliable product that passes reflow thermal cycling test at 85°C @85% relative humidity and is ideal for fine pitch RGB.

Technical Specifications

General Properties

Refractive index

Refractive index
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.

The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.

1.56

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.67

Chemical Properties

Water Absorption @ 23°C/24h

0.11 %

Mechanical Properties

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D)	90

Flexural Modulus
Flexural Modulus @ 25°C	3800 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	110 N/mm2

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	50 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	120 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 160°C / 320°F	25 - 45 sec

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

135 °C

Spiral Flow
Spiral Flow @ 175°C	150 - 250 cm

Curing Conditions

Curing Schedule

Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.

Post Mold Cure
Post Mold Cure @ 150°C / 302°F	4 - 6 hrs

Additional Information

The epoxy molding compound is sealed with aluminum laminated bags, in quantities of 1kg/bag in a 10kg/box.
Each carton box legibly provides the following information: Item name, Size, Lot NO, Quantity, MFG date, EXP date, and other information customer required.