BMI-6000 Imide-extended Bismaleimide Oligomer

Harmonization Code : 2925.19.95.90 |   Carboxyimide-function compounds (including saccharin and its salts) and imine-function compounds : Imides and their derivatives; salts thereof : Other : Other : Other
Main features
  • Superior thermal stability
  • Good dielectric properties
  • Toughener

Product Description

BMI-6000 has been designed as a curable, low DK and Df alternative to replace both the Kapton and adhesive layers in the manufacture of FCCL materials. The material has excellent thermal stability and workability. It is soluble in a variety of solvents such as cyclopentanone, cyclohexanone, MEK, DMF, DMAC, and NMP in combination with aromatic solvents. It can be processed in a resin system as a solid or dissolved in a solvent.

BMI-6000 is recommended for use as an adhesive layer when laminating materials for FCCL applications. Adhesion promoters, solvent(s), are required for successful use. BMI6000 has  much higher Tg than products such as BMI-689 and require thermal curing to obtain the published values. This material is not suitable for UV curing.

Aromatic BMI resins lose some of their user-friendly nature compared to the aliphatic versions: they are less soluble in normal solvents, less compatible with other resins, require more complicated curing processes, etc. 

BMI-6000 is typically cured using dicumyl peroxide. Please see the curing process described in the TDS. You may want to develop your own process. If so, insure all solvent is removed prior to entering the cure process window.
Product Family
1kg Jar
Normal Price
Sale Price
Quantity OrderedPrice per Jar
  1 - 4 Jar  $720.636 /Jar
  5 - 9 Jar  $547.115 /Jar
  10 - 24 Jar  $431.047 /Jar
  25 - 99 Jar  $376.821 /Jar
  100 - 499 Jar  $323.977 /Jar
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Technical Specifications

General Properties
Appearance at room temperature.
Light yellow
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
31 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
214 °C

Additional Information

What are the main differences with BMI 6100?

BMI-6100 is a little different than 6000 in that the Tg of the resin is dependent on the temperature used to cure the material. Dicumyl peroxide can be used to speed the cure at low temperatures but the temperature of activation is too low to be useful in obtaining elevated Tg values that the material is capable of obtaining. Please see the TDS (attached) for cure suggestions. Again, BMI-6000/6100 are not suitable for UV curing.
We use anisole for the BMI-6100 for two reasons:
  1. The reaction to form the product is performed in anisole and for economy, we prefer to leave it in anisole
  2. We are unable to precipitate this higher molecular weight material to form a solid powder - it forms a gooey mess. 
We can remove most of the anisole and substitute an alternative solvent (I'm not sure what would be compatible at the present time) at substantial extra cost - and the material is expensive already!. In addition, we have not been successful in removing all of the anisole before taking it back up in solvent.