BS-858 | Low Pressure Molding (LPM)

Main features

Enhanced UV resistance versus standard PA
High hardness and cohesion
Flammability UL94:V0

Product Description

BS-858 Black is a non-reactive, solvent-free copolymer polyamide hot melt resin, specially developed for low pressure molding (LPM) applications requiring enhanced UV resistance, high cohesion, and superior mechanical durability. It is ideally suited for the encapsulation and protection of electronic and electrical components, connectors, and cable junctions—especially in environments with UV exposure or where surface hardness is a key requirement.

Formulated for outdoor and semi-outdoor applications, BS-858 delivers excellent adhesion, robust mechanical properties, and UL94 V-0 flammability rating, while maintaining long-term performance in thermally and electrically demanding environments.

BS 858 was developed specifically for improving adhesion on a wide range of substrates and offers cohesiveness at negative temperatures (-35°C). It is mainly used for molding of electronic/electric components, connectors and cables.

Typical Applications:

Overmolding of automotive sensors and connectors exposed to sunlight
Potting of industrial control units, LED drivers, and junction boxes
Protective molding for outdoor telecom and sensor assemblies

Product Family
BS-858

1. Select Package Type

Triplex Bags 20KG

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

4000 - 6000 mPa.s

Young's modulus

90 MPa

Mechanical Properties

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D)	49

Tensile Strength

Tensile Strength
The tensile strength of a material is the maximum amount of tensile stress that it can withstand while being stretched or pulled before failure.

Some materials break very sharply, without plastic deformation, in what is called a brittle failure. Others, which are more ductile, including most metals, experience some plastic deformation and possibly necking before fracture.

Tensile Strength

Tensile Strength
Tensile strength determines the resistance of a material to break under tension and it measures how much elongating load (or tensile stress) it can handle before fracture.

To make it simple, it measures how much force we have to apply when pulling apart a material before it breaks.

8.1 MPa

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

- 35 °C

Melting Temperature
Melting temperature	210 - 230 °C

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Temperature	70 °C
Mold Temperature	20 - 60 °C