CC-SAC305 | Copper Core SAC 305 Solder spheres

Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • SAC 305 alloy
  • Core of the sphere is Copper
  • Excellent fatigue resistance

Product Description

LINQALLOY CC-SAC305 solder Spheres are lead-free Tin/Silver/Copper alloys that contain 96.5% Tin (Sn), 3% Silver (Ag), and 0.5% Copper (Cu) and is often written as Sn96.5Ag3.0Cu0.5. These are not the normal SAC305 spheres since they have a copper core that enables "no tilt" designs and can act as a spacer for applications that require perfect BLT control. The size of the core depends on the diameter of the sphere.

LINQALLOY CC-SAC305 offers has excellent fatigue resistance and it is compatible with all flux types. It exhibits excellent joint reliability and it is the best wetting Sn/Ag/Cu alloy in the market.


Product Family
300 kpcs/jar 1000 kpcs/jar
0.150 mm 0.250 mm 0.300 mm 0.350 mm 0.750 mm 0.889 mm

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
Alloy Type
Alloy Type
A metallic element type
Density (g) 7.4 g/cm3
Mechanical Properties
Elongation is the process of lengthening something.

It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.

It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
37 %
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
23.8 ppm/°C
Melting Temperature
Liquidus Melting Temperature
Liquidus Melting Temperature
Liquidus, is the temperature point at which an alloy becomes completely liquid.
219 °C
Solidus Melting Temperature
Solidus Melting Temperature
Solidus is the temperature point at which a completely solid alloy starts melting and becoming softer.
217 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
71.8 W/m.K

Additional Information

Each jar has a clear label on the lid specifying the solder ball diameter as well as a label on the front identifying the alloy type, the quantity of spheres in the jar, the date of manufacture, and the product lot (or batch) number. This batch number is also tied to a certificate of conformance that is also provided with the solder spheres and ensures the SAC305 solder spheres meet the following quality criteria:

  • Tin (Sn): 96.5%
  • Silver (Ag): 3%
  • Copper (Cu): 0.5%
  • Melting Temperature (Solidus): 217°C
  • Melting Temperature (Liquidus): 219°C
  • Spheroid Tolerance : Within 1.5%

Diameter Tolerance

  • 0.075mm - 0.15mm (3-6 mils) : ±0.005mm (±0.2 mils)
  • 0.20mm - 0.60mm (8-24 mils) : ±0.010mm (±0.4 mils)
  • 0.65mm - 0.76mm (25-30 mils) : ±0.015mm (±0.6 mils)

Sphere diameter and Copper Core size reference

  • 100 um – 60 um Core Copper
  • 150 um – 110 um Core Copper
  • 250 um – 210 um Core Copper