EMC-G274 | Epoxy Molding Compound for Photocouplers

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Main features

Good moldability
Designed for photocoupler / optocoupler devices
Excellent mechanical integrity

Product Description

LINQSOL™ EMC-G274 is a halogen-free epoxy molding compound engineered for photocoupler/optocoupler devices. It offers excellent moldability (spiral flow  of 105 cm at 175 °C), low moisture absorption ( 0.5% PCT 24 h), and superior mechanical strength (flexural strength = 160 MPa). With a glass transition of 147 °C ensures reliability in high-stress, high-temperature environments. Its factor in low ion content and high volume resistivity makes it ideal for sensitive optoelectronic applications.

LINQSOL EMC-G274 guarantees strong performance and outstanding long-term reliability in demanding environments. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, EMC-G274 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

LINQSOL EMC-G274 is available in custom pellet dimensions. Contact us for specifications.

Key Features

Fast Gel & High Flowability – 27 s gel time, 105 cm spiral flow at 175 °C: enables efficient molding cycles.
High Tg (147 °C) – Maintains dimensional and thermal stability under elevated temperature.
Low Moisture Absorption (0.5%) – Enhances reliability by mitigating “popcorn” cracking in moisture-sensitive devices.
Strong Mechanical Integrity (160 MPa) – Delivers robust package strength and resistance to mechanical stress.
High Electrical Insulation – Volume resistivity 8 × 10¹⁵ Ω·cm ensures excellent dielectric performance.
UL‑94 V‑0 Flame Resistance – Complies with stringent flammability standards for electronic components.

Ideal for photocoupler/optocoupler devices requiring:

Reliable encapsulation in transfer molding applications
Low-stress dielectric protection in optical signal pathways
High-voltage isolation in light-transmitting packages
Thermal cycling stability and moisture-resistant packaging

Product Family
EMC-G274

1. Select Pellet Weight

8 gr

2. Available Pellet Size

16 mm

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.89

Physical Properties

Spiral Flow @ 175°C

105 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	7 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	7 ppm

Water Absorption

0.5 %

Electrical Properties

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
Conductivity	0.03 mmhos/cm

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

8.0x10¹⁵ Ohms⋅cm

Mechanical Properties

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	160 N/mm2

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
pH of extract	6.8

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	15 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	56 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	27 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

147 °C

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Additional Information

EMC-G274 Recommended Mold Parameters

Parameter	Value	Unit
Molding temperature	170–180	°C
Transfer pressure	40–70	kg_f/cm²
Transfer time	10–20	s
Cure time at 175 °C	120–150	s
Post-mold cure time at 175 °C	6–8	h

The curing conditions provided are recommended guidelines based on typical laboratory results. Actual curing parameters should be defined and validated by the user to ensure compatibility with specific materials, part geometries, and end-use requirements. It is the user’s responsibility to optimize and confirm curing conditions that meet their performance and quality standards.

Processing Instructions

Before use, let LINQSOL™ EMC-G274 reach room temperature (23 ±5 °C) for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.

Use the materials within 72 hours after removing the container from cold storage.

Storage and Handling

LINQSOL™ EMC-G274 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.

The technical information presented in this document is provided for reference only and does not constitute a guarantee of specific properties or performance. Actual results may vary depending on individual conditions and application methods. Users are strongly advised to perform their own testing and validation to determine suitability for their intended use and compliance with relevant regulations.