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Hysol GR2320 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • For MnO Tantalum Capacitors
  • Black colored
  • Halogen-free version of MG33F-0602 & MG33F-0593

Product Description

Hysol GR2320 is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of Manganese Oxide or MnO2 tantalum capacitors. This laser markable product is filled by 71% filler weight, has low ionic impurities and excellent thermal cycling performance.

Hysol GR2320 is an Environmentally "Green" product that replaces MG33F-0602 & MG33F-0593. Environmentally "green", meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. MG33F-0602 & MG33F-0593 dominated the space for tantalum capacitors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products.

Hysol GR2320 is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Maganese Oxide MnO2 capacitors. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment while it also meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.


Product Family
GR2320 Black  
14.3 mm 14 mm
4.4 gr 5 gr 3.2 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications

General Properties
The color
Filler Content 71 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 365 days
Chemical Properties
Extractable Ionic Content, after 20 hours
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
10 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
4 ppm
Mechanical Properties
Water Extract Data, 20hrs water boil
Water Extract Data, 20hrs water boil
Water Extract Data, 20hrs water boil
Conductivity 20 mmhos/cm
pH of extract 6
Flexural Modulus
Flexural Modulus @ 25°C 13500 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
140 N/mm2
Molded Shrinkage 0.25 %
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.0x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
20 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
75 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 14 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
170 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.7 W/m.K
Spiral Flow
Spiral Flow @ 175°C 76.2 cm
UL94 Rating
UL94 @ 1/4 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F 70 - 90 s
Mold Temperature 140 - 180 °C
Preheat Temperature 80 - 95 °C
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 6 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 2 - 6 hrs