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Hysol GR2812 | Gold Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Hysol GR2812 | Gold Epoxy Mold Compound
Hysol GR2812 | Gold Epoxy Mold Compound
Hysol GR2812 | Gold Epoxy Mold Compound
Main features
  • Replaces GR2811
  • Thin wall crack resistance
  • MSL3 260°C capability

Product Description

Hysol GR2812 is a gold, silica filled (90%) semiconductor epoxy molding compound designed for the encapsulation and protection of thin walled conductive polymer tantalum solid capacitors (POSCAP). Once molded and post-mold cured, this product provides optimium protection and reliability for these capacitor devices

Hysol GR2812 is designed for Conductive Polymer Tantalum Solid Capacitors (POSCAP). In the world of passive components, POSCAPs are relatively new to the scene. These solid electrolytic capacitors have many advantages, but offer challenges for epoxy mold compound manufacturers. The two main challenges are for these devices are thin wall crack resistance as well as MSL3 260°C capability. Furthermore, it must be fast-cure in order to be optimized for automolding equipment.

Hysol GR2812 replaces GR2811. It is the next generation of environmentally "green" products from Hysol. The previous generation GR2811 was able to withstand thin-wall crack resistance, but was not able to pass MSL3 260°C JEDEC reflow. After several trials and developments, Hysol successfully developed GR2812 which passes the electrical requirements of Conductive Polymer Tanatalum Capacitors, but also withstands JEDEC level MSL3 260°C reflow thin wall crack resistance.

Hysol GR2812 does not contain any bromine, antimony or phosphorus flame retardants, making it still an environmetally "green" halogen-free epoxy mold compound. This next generation epoxy mold compound replaces older generation products of GR2811, but also the non-halogen containing predecessors MG33F-0520 and MG33F-0602. This material is designed to achieve JEDEC Level 3 requirements at 260°C reflow temperature on conductive polymer capacitors. It's fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR2812 meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.

 

Product Family
GR2812  
Pellet
14.3 mm 14 mm
4.6 gr 3.4 gr
15 kg

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Gold
Filler Content 90 %
Filler Size Cut 75 µm
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 2
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 183 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 7.7 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 2.7 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 24h @ PCT 0.25 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 23900 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 150 N/mm2
Storage (DMA) Modulus
Storage (DMA) Modulus @ 175°C 1,363 N/mm2
Storage (DMA) Modulus @ 25°C 28,680 N/mm2
Storage (DMA) Modulus @ 260°C 1,221 N/mm2
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 3.0x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 7 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 29 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 20 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 105 °C
Spiral Flow
Spiral Flow @ 175°C 73 cm
UL94 Rating
UL94 @ 1/4 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F 45 - 120 s
Mold Temperature 170 - 190 °C
Preheat Temperature 70 - 90 °C
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 5 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs