Hysol GR2812 | Gold Epoxy Mold Compound
- Replaces GR2811
- Thin wall crack resistance
- MSL3 260°C capability
Hysol GR2812 is designed for Conductive Polymer Tantalum Solid Capacitors (POSCAP). In the world of passive components, POSCAPs are relatively new to the scene. These solid electrolytic capacitors have many advantages, but offer challenges for epoxy mold compound manufacturers. The two main challenges are for these devices are thin wall crack resistance as well as MSL3 260°C capability. Furthermore, it must be fast-cure in order to be optimized for automolding equipment.
Hysol GR2812 replaces GR2811. It is the next generation of environmentally "green" products from Hysol. The previous generation GR2811 was able to withstand thin-wall crack resistance, but was not able to pass MSL3 260°C JEDEC reflow. After several trials and developments, Hysol successfully developed GR2812 which passes the electrical requirements of Conductive Polymer Tanatalum Capacitors, but also withstands JEDEC level MSL3 260°C reflow thin wall crack resistance.Hysol GR2812 does not contain any bromine, antimony or phosphorus flame retardants, making it still an environmetally "green" halogen-free epoxy mold compound. This next generation epoxy mold compound replaces older generation products of GR2811, but also the non-halogen containing predecessors MG33F-0520 and MG33F-0602. This material is designed to achieve JEDEC Level 3 requirements at 260°C reflow temperature on conductive polymer capacitors. It's fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR2812 meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.
| Color |
|Filler Content||90 %|
|Filler Size Cut||75 µm|
| Specific Gravity |
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
|Spiral Flow @ 175°C||73 cm|
|Moisture absorption||0.25 %|
| Volume Resistivity |
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
| UL 94 Rating |
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.
HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
|Transfer Pressure||40 - 85 kg/cm2|
|Transfer Time||5 - 15 s|