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Hysol GR2820 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Main features

For Conductive Polymer Tantalum Solid Capacitors
Ultra-low stress
Thin Wall Crack Resistance

Product Description

Hysol GR2820 is a black, ultra low stress, semiconductor-grade epoxy molding compound designed for the encapsulation and protection of thin walled conductive polymer tantalum solid capacitors (POSCAP). In the world of passive components, POSCAPs are relatively new to the scene. These solid electrolytic capacitors have many advantages, but offer challenges for epoxy mold compound manufacturers. After many years of development, the GR2820 has been developed to have excellent thin wall crack resistance - the greatest challenge of molding these devices. Furthermore, it has been optimized for automolding equipment.

Hysol GR2820 is a silica filled(81%) environmentally "green" halogen free product, meaning it doesn't contain any bromine, antimony or phosphorus flame retardants. Previous MG-series EMC dominated the space for tantalum capacitors but used halogen-containing flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on conductive polymer capacitors. It's fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR2820 meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.

Product Family
GR2820 Black

1. Select Product Form

Pellet

2. Available Pellet Size

13 mm

3. Available Pellet Weight

5.8 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Technical Specifications

General Properties

Color

Color
The color

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.90

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -4°C	183 days

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	7 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	6.6 ppm

Moisture Absorption

Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.

Moisture absorption - 168h @ 85ºC | 85% RH

0.37 %

Mechanical Properties

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
Conductivity	40 mmhos/cm

Flexural Modulus
Flexural Modulus @ 25°C	14000 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	107 N/mm2

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

1.6x10¹⁶ Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	12 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	45 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	20 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

183 °C

Spiral Flow
Spiral Flow @ 175°C	66 cm

UL94 Rating
UL94 @ 1/4 inch	V0

Curing Conditions

Curing Time
Curing Time @ 175°C / 347°F	90 - 120 s

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	3 - 6 hrs

Additional Information

Applications

Short Description of Hysol GR2820 | Black Epoxy Mold Compound
Typical applications and uses of Hysol GR2820 \| Black Epoxy Mold Compound include: Condutive Polymer Tantalum Solid Capacitors (POSCAP) Other Tantalum Capacitors Technical Datasheets for Hysol GR2820 \| Black Epoxy Mold Compound TDS (English) Click to access Hysol GR2820 \| Black Epoxy Mold Compound Technical Data Sheet *Note that only registered users may access technical datasheets

Packaging Details

Packaging Details for Hysol GR2820 | Black Epoxy Mold Compound
The following information is specifically related to each unit of measure of Hysol GR2820 \| Black Epoxy Mold Compound. If you which to compare this to other product sizes, click on the respective product from the list above and check here for values specific to that product. These values are taken from our internal database and are used in the calculation of the gross weight and packaging dimensions of the goods during shipping. You can use these values to approximate delivery charges using your own carrier.