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Hysol GR2822 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • For Conductive Polymer Tantalum Solid Capacitors
  • Ultra-low stress epoxy mold compound
  • MSL3 260°C - Thin Wall Crack Resistance

Product Description

Hysol GR2822 is a silica filled (88%), black, epoxy molding compound. Despite what the name implies, it is not a newer version of 2820 but an improved version of our gold GR2811. Hysol GR2811 showed poor moisture resistance (crack after MSL3) and discolouration issues under harsh circumstances. GR 2822 was developed to solve those issues and while black, be used for demanding applications.

Hysol GR2822 heat curable EMC, meets JEDEC MSL 3 requirements and is a green product designed for tandalum conductive polymer capacitors. It exhibits very low stress, low moisture absorption and good electrical performance.

Product Family
GR2822 Black  
Pellet
14 mm
3.4 gr
1 kg

Catalog Product

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Technical Specifications

General Properties
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.98
Color
Color
The color
Black
Filler Content 88 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -4°C 183 days
Chemical Properties
Extractable Ionic Content, after 20 hours
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
8 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
2.9 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 168h @ 85ºC | 85% RH 0.26 %
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.4x1016 Ohms⋅cm
Thermal Properties
Spiral Flow
Spiral Flow @ 175°C 99 cm
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
105 °C
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
7 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
36 ppm/°C
UL94 Rating
UL94 @ 1/4 inch V0
Curing Conditions
Preheat Temperature 70 - 90 °C
Mold Temperature 170 - 190 °C
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 5 - 20 s
Curing Time
Curing Time @ 175°C / 347°F 45 - 120 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 12 hrs

Additional Information

Applications

Short Description of Hysol GR2822 | Black Epoxy Mold Compound

Typical applications and uses of Hysol GR2822 | Black Epoxy Mold Compound include:

  • Condutive Polymer Tantalum Solid Capacitors (POSCAP)
  • Other Tantalum Capacitors

Technical Datasheets for Hysol GR2822 | Black Epoxy Mold Compound

TDS (English) Kapton_Technical_Data_Sheet Click to access Hysol GR2822 | Black Epoxy Mold Compound Technical Data Sheet
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Packaging Details

Packaging Details for Hysol GR2822 | Black Epoxy Mold Compound

The following information is specifically related to each unit of measure of Hysol GR2822 | Black Epoxy Mold Compound. If you which to compare this to other product sizes, click on the respective product from the list above and check here for values specific to that product. These values are taken from our internal database and are used in the calculation of the gross weight and packaging dimensions of the goods during shipping. You can use these values to approximate delivery charges using your own carrier.