Hysol GR2822 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • For Conductive Polymer Tantalum Solid Capacitors
  • Ultra-low stress epoxy mold compound
  • MSL3 260°C - Thin Wall Crack Resistance

Product Description

Hysol GR2822 is a silica filled (88%), black, epoxy molding compound. Despite what the name implies, it is not a newer version of 2820 but an improved version of our gold GR2811. Hysol GR2811 showed poor moisture resistance (crack after MSL3) and discolouration issues under harsh circumstances. GR 2822 was developed to solve those issues and while black, be used for demanding applications.

Hysol GR2822 heat curable EMC, meets JEDEC MSL 3 requirements and is a green product designed for tandalum conductive polymer capacitors. It exhibits very low stress, low moisture absorption and good electrical performance.

Product Family
GR2822 Black  
Pellet
14 mm
3.4 gr
1 kg

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Black
Filler Content 88 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.98
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -4°C 183 days
Physical Properties
Spiral Flow @ 175°C 99 cm
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 8 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 2.9 ppm
Moisture absorption 0.26 %
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 1.4x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1
Coefficient of Thermal Expansion (CTE) , α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 7 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 36 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 105 °C
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
 V0
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F 45 - 120 s
Mold Temperature 170 - 190 °C
Preheat Temperature 70 - 90 °C
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 12 hrs
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 5 - 20 s

Additional Information

Applications

Short Description of Hysol GR2822 | Black Epoxy Mold Compound

Typical applications and uses of Hysol GR2822 | Black Epoxy Mold Compound include:

  • Condutive Polymer Tantalum Solid Capacitors (POSCAP)
  • Other Tantalum Capacitors

Technical Datasheets for Hysol GR2822 | Black Epoxy Mold Compound

TDS (English) Kapton_Technical_Data_Sheet Click to access Hysol GR2822 | Black Epoxy Mold Compound Technical Data Sheet
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Packaging Details

Packaging Details for Hysol GR2822 | Black Epoxy Mold Compound

The following information is specifically related to each unit of measure of Hysol GR2822 | Black Epoxy Mold Compound. If you which to compare this to other product sizes, click on the respective product from the list above and check here for values specific to that product. These values are taken from our internal database and are used in the calculation of the gross weight and packaging dimensions of the goods during shipping. You can use these values to approximate delivery charges using your own carrier.