Product Description
Hysol GR640HV is a black, transfer molded semiconductor epoxy molding compound. Once transfer molded and post-mold cured, it has excellent mechanical and electrical properties. It offers an excellent balance between outstanding performance, low stressm ease of use (which allows multiple shots between cleaning) and low cost of ownership.
Hysol GR640HV is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on small outline packages including SOT, SOD and SMX package types. Hysol GR640HV meets UL 94 V-0 Flammability at 1/8 inch (3.175mm) thickness.
Hysol GR640HV is designed for the following semiconductor discrete packages:
- Small outline transistor (SOT) packages
- Small outline device (SOD) packages
- SMA, SMB and other SMX packages