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Hysol GR640HV-L1 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Hysol GR640HV-L1 | Black Epoxy Mold Compound
Hysol GR640HV-L1 | Black Epoxy Mold Compound
GR640HV-L1 Black Epoxy Mold Compound
GR640HV-L1 for SOD/SOT/SMX devices
Hysol GR640HV-L1 | Black Epoxy Mold Compound
GR640HV-L1 Black Epoxy Mold Compound
Main features
  • Improved electrical performance version of GR640HV
  • Ideal for TO, SMX and SOT/SOD Packages
  • JEDEC 1 260°C capable product

Product Description

Hysol GR640HV-L1 is a black, heat-curable epoxy molding compound that delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature.  It is an improved version of GR640HV with better electrical performance version.

Hysol GR 640HV-L1 is a "Green" low stress product with low cost of ownership that meets the strict MSL1 JEDEC requirements. It is designed for  semiconductor discrete packages such as TO220, TO247 and other TO packages, SMA, SMB and other SMX packages and Transformers. GR640HV-L1 meets UL 94 V-0 Flammability at ¼ inch thickness.

 
Product Family
GR640HV-L1  
Pellet
14 mm 35 mm
2.7 gr 4.3 gr 41 gr 68 gr
15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Black
Filler Content 75 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.85
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 365 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 21 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 6 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 24h @ PCT 0.42 %
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 1.2x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 16 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 58 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 28 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 165 °C
Spiral Flow
Spiral Flow @ 175°C 71 cm
UL94 Rating
UL94 @ 1/4 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F (Automold) 50 - 90 s
Curing Time @ 175°C / 347°F (Conventional Mold) 60 - 120 s
Mold Temperature 150 - 195 °C
Preheat Temperature 80 - 100 °C
Transfer Pressure 40 - 100 kg/cm2
Transfer Time 10 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs