Hysol GR730HT| Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • Halogen free
  • High adhesion
  • High thermal conductivity

Product Description

Hysol GR730HT is a halogen free, black, silica filled (90% filler weight) semiconductor grade epoxy molding compound designed for Power Supply in Package (PSIP). This low stress, low moisture absorption product is a commercial success with many uses on TO applications.

Hysol GR730HT is a black, heat curable epoxy molding compound that can be used in semiconductor packages such as TO252. Furthermore, it meets UL 94 V-0 flammability at 1/8 inch thickness.

Product Family
16 mm
7.6 gr
10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
The color
Filler Content 90 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Physical Properties
Spiral Flow @ 175°C 76 cm
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
9 ppm
Moisture absorption 0.24 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 23000 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
104 N/mm2
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
8.0x1015 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
13 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
50 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 20 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
200 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
3.2 W/m.K

Additional Information


Property GR730HT (86W9HT) GR730HT (96G18) XX-G1250S X5HT XX-G3000HT
Filler content 90 90 86 87
Epoxy Modified Multi
functional type
Hydrophobic EP Modified Multi
functional type
Hydrophobic EP
Spiral Flow (inch) 76 86 120 120
Gel time (s) 20 30 30 35
Viscosity (PaS) 12 10 15 8
Specific Gravity 2.84 2.67 2.93 2.85
CTE 1 13 13 14 15
CTE 2 50 40 48 50
Tg (°C) 200 122 215 130
Flexural Strength/Modulus, Mpa 104/ 23000 122/ 24000 143/ 29000 180/ 25000
Mold Shrinkage (%) 0.14 0.25 0.12 0.33
Moisture Absorption PCT 0.24 0.24 0.45 0.35
Volume Resistance (@ 150) NA NA 5E12 5E12
Volume Resistance (@ RT) 8E15 7E15 NA NA
Impurity CI- 9 9 9 8
Thermal conductivity (W/mK) 3.2 3 2.9 3