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Hysol GR825-73B | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR825-73B Black Epoxy Mold Compound for SOIC14 mini pellets

GR825-73B Black Epoxy Mold Compound for SOIC14

Main features

MSL 1 260°C
Designed for SOIC, SOP, SSOP & QSOP
Ideal for NiPdAu (PPF) & Ag-spot leadframes

Product Description

Hysol GR825-73B is a black, semiconductor grade epoxy molding compound that was designed for SOIC packages. It was first qualified as MSL1 260°C on a 14 pin SOIC package with a die size of 1.4x 0.9mm (58 x 36 mils) using a Nickel Palladium Gold (NiPdAu) leadframe, also referred to as a preplated leadframe (PPF). It has since been used in mass production on this semiconductor package. Except for SOIC, it can also be used on, SOP, SSOP & QSOP packages.

Hysol GR825-73B is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant and has been used in mass scale production since 2007. GR825-73B epoxy mold compound meets UL 94 V-0 Flammability at 3mm (1/8") thickness.

Product Family
GR825-73B

1. Select Product Form

Pellet

2. Available Pellet Size

14 mm

3. Available Pellet Weight

6 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications

Technical Specifications

General Properties

Color

Color
The color

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.9

Flash Flash Mold Flash, as measured in millimeters in diverse thickness channels
Flash, 0.25mil channel Flash, 0.25mil channel Flash in millimeters in a 0.25mil deep channel	1 mm
Flash, 0.5mil channel Flash, 0.5mil channel Flash in millimeters in a 0.5mil deep channel	1 mm
Flash, 1mil channel Flash, 1mil channel Flash in millimeters in a 1mil deep channel	1 mm
Flash, 2mil channel Flash, 2mil channel Flash in millimeters in a 2mil deep channel	4 mm

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days

Chemical Properties

Moisture Absorption

Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.

Moisture absorption - 168h @ 85ºC | 85% RH

0.32 %

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 21°C Flexural Modulus @ 21°C Flexural Modulus taken at 21°C	1900 N/mm2
Flexural Modulus @ 25°C	22000 N/mm2

Flexural Strength
Flexural Strength @ 21°C	12 N/mm2
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	20 N/mm2

Electrical Properties

Dielectric Constant Dielectric Constant Dielectric Constant (k), commonly known as relative permittivity, is a number relating the ability of a material to carry alternating current to the ability of vacuum to carry alternating current. It determines the ability of an insulator to store electrical energy and is the ratio of electric permeability in vacuum against the electric permeability of a material. The lower the dielectric constant (κ) and dissipation factor, the less energy is absorbed from an electric field, making it a much better insulator. It is a dimensionless property that can be affected by various factors such as the thickness uniformity of a material, insufficient contact between the sample and electrodes, water adsorption and contact resistance.
Dielectric Constant @ 23 ˚C/1 kHz	4.1
Dielectric Constant @ 23 ˚C/100 kHz	4.0

Dielectric Strength

Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.

Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.

As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.

37 kV/mm

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

1.1x10¹⁶ Ohms⋅cm

Dissipation Factor Dissipation Factor Dissipation factor is commonly known as loss tangent or tan delta.   It is a ratio of the loss index and the relative permittivity and it measures the inefficiency of an insulating material to maintain energy (that otherwise dissipates in the form of heat). The lower the factor, the better the insulation. It is the reciprocal of the quality factor and always refers to a specific temperature and frequency.
Dissipation Factor @ 23°C /1 kHz	0.004
Dissipation Factor @ 23°C /100 kHz	0.010

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	12 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	45 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	22 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

135 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.8 W/m.K