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Hysol GR825-73B is a black, semiconductor grade epoxy molding compound that was designed for SOIC packages. It was first qualified as MSL1 260°C on a 14 pin SOIC package with a die size of 1.4x 0.9mm (58 x 36 mils) using a Nickel Palladium Gold (NiPdAu) leadframe, also referred to as a preplated leadframe (PPF). It has since been used in mass production on this semiconductor package. Except for SOIC, it can also be used on, SOP, SSOP & QSOP packages.
Hysol GR825-73B is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant and has been used in mass scale production since 2007. GR825-73B epoxy mold compound meets UL 94 V-0 Flammability at 3mm (1/8") thickness.