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Hysol KL-G100S is a black, semiconductor grade, high productivity molding compound, providing a wide operation window. It is 80% filled with spherical/fused silica and achieves a flammability rating of V0 at UL94 testing conditions.
Hysol KL-G100S is an environmentally friendly molding compound with high moldability that has a low coefficient of thermal expansion (13ppm/°C). It is typically used for SOD, MBF and ABS semiconductor packages.