Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
HYSOL MG 36F-25A is a black, epoxy based molding compound that is designed for the encapsulation of discrete semiconductor devices and low pin count PDIP. It can be applied using both conventional and automold equipments.
HYSOL MG 36F-25A meets UL 94 V0 flammability rating at 3mm thickness. It is a legacy, tried and proven product that has been used extensively from Automotive manufacturers.
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container labeling.
Powder Storage - Powder or preforms should be stored at 10ºC or below, in closed containers. After removal from cold storage, the material MUST be allowed to come to room temperature, in the sealed container, to avoid moisture contamination. The suggested waiting time for a standard 22 kg pail is 24 hours.