Product Description
HYSOL MG 36F-25A is a black, epoxy based molding compound that is designed for the encapsulation of discrete semiconductor devices and low pin count PDIP. It can be applied using both conventional and automold equipments.
HYSOL MG 36F-25A meets UL 94 V0 flammability rating at 3mm thickness. It is a legacy, tried and proven product that has been used extensively from Automotive manufacturers.