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Hysol MG40FS-AM | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
MG40FS-AM Black Epoxy Mold Compound
MG40FS-AM Black Epoxy Mold Compound
MG40FS-AM Black Epoxy Mold Compound
MG40FS-AM Automold Black Epoxy Mold Compound
MG40FS-AM Automold Black Epoxy Mold Compound
MG40FS-AM Black Epoxy Mold Compound
MG40FS-AM Black Epoxy Mold Compound
Main features
  • Automold version of MG40FS
  • PDIP, SOIC packages
  • Ideal for high voltage discrete semiconductors

Product Description

Hysol MG40FS-AM is the AutoMold version of MG40FS. It is a high productivity molding compound designed specifically for high volume encapsulation of PDIP, SOIC, Power discrete and High Voltage devices. This material is applicable for devices having chip dimensions up to 150 mils square. It has been formulated to provide the best possible moldability and as wide molding latitude as possible

Hysol MG40FS has excellent high temperature electrical stability. This makes it ideal for PDIP, TO220, TO247 and high voltage discrete semiconductor packages that need to resist higher temperatures. This product is available in both conventional (MG40FS) and automold (MG40FS-AM) versions. 

Product Family
MG40FS-AM  
Pellet
48 mm
128 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Black
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.84
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 365 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 5 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 5 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 168h @ 85ºC | 85% RH 0.85 %
Mechanical Properties
Water Extract Data
Water Extract Data
Water Extract Data, 20hrs water boil
Conductivity 40 mmhos/cm
pH of extract 4.3
Flexural Modulus
Flexural Modulus @ 25°C 17000 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 131 N/mm2
Molded Shrinkage 0.5 %
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 1.0x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 20 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 75 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 25 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 160 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 0.95 W/m.K
UL 94 Rating
UL 94 Rating
The UL 94 standard classifies plastics according to how they burn in various orientations and thicknesses. From lowest (least flame-retardant) to highest (most flame-retardant):
HB: slow burning on a horizontal specimen; burning rate particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole.
 V0
Spiral Flow
Spiral Flow @ 175°C 71 cm
UL94 Rating
UL94 @ 1/4 inch V0
UL94 @ 1/8 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F (Automold) 30 - 60 s
Curing Time @ 190°C / 374°F (Automold) 20 - 45
Mold Temperature 175 - 190 °C
Preheat Temperature 85 - 100 °C
Transfer Pressure 40 - 100 kg/cm2
Transfer Time 15 - 25 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 2 - 4 hrs