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Hysol MG52F-99B NXP | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • MSL 1 260°C
  • Ideal for Cu, & Pd plated leadframes
  • 28, 48 and 56 pin TSSOP

Product Description

Hysol MG52F-99B NXP is a high productivity molding compound, designed for high volume encapsulation of surface mount devices. MG52F-99B NXP is applicable for devices having chip dimensions up to 1 centimeter (400 mils) square. Various versions are available including MG52F. MG52-99B NXP which is designed to provide much improved moisture performance after preconditioning. It can be applied using both conventional and automold equipment.

MG52F-99B NXP was designed for and passed qualification testing on 28, 48 and 56 pin TSSOP packages and has been used in production for more than 20 years. These packages have a copper leadframe with palladium plating. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on copper based, palladium-plated leadframes. Hysol MG52F-99B NXP meets UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness.

MG52F-99B NXP has high adhesion to a wide range of substrates including Nickel and Palladium, Low stress, fast cure and a large operating window, ideal for low wire sweep molding.

Product Family
MG52F-99B NXP  
Pellet
20 mm
10 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 - 12 weeks Shipping in 8 - 12 weeks

Technical Specifications

General Properties
Color
Color
The color
Black
Filler Content 78.8 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.88
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 365 days
Chemical Properties
Extractable Ionic Content, after 20 hours
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
2 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
2 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 168h @ 85ºC | 85% RH 0.57 %
Mechanical Properties
Water Extract Data, 20hrs water boil
Water Extract Data, 20hrs water boil
Water Extract Data, 20hrs water boil
Conductivity 40 mmhos/cm
pH of extract 4.5
Flexural Modulus
Flexural Modulus @ 25°C 16600 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
152 N/mm2
Molded Shrinkage 0.28 %
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.0x1017 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
14 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
56 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 21 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
155 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.95 W/m.K
Spiral Flow
Spiral Flow @ 175°C 78 cm
UL94 Rating
UL94 @ 1/4 inch V0
UL94 @ 1/8 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F 70 - 100 s
Mold Temperature 175 - 190 °C
Preheat Temperature 70 - 90 °C
Transfer Pressure 40 - 100 kg/cm2
Transfer Time 5 - 30 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 1 - 2 hrs

Additional Information

MG52F-99B NXP has passed the following testing:

  • Operating Life Static Test, 125° C, 5.5V 1000 Hours: Passed
  • Biased Humidity, 85° C / 85% R H, 1000 Hours: Passed
  • Autoclave, 121° C, 15 psi, 240 Hours: Passed
  • Temperature Cycle Test, -65° C to 150° C, 1000 Cycles: Passed
  • Storage Life Test, 150° C, 1000 Hours: Passed
  • Thermal Shock Test, -55° C to 125° C, 500 Cycles: Passed
  • Solder Heat, 260° C, 10 Sec, 1 Cycle: Passed
  • Lead Pull to Destruction: Passed
  • X-Ray: Passed