Hysol MG52F | Black Epoxy Mold Compound
- Designed for DL TSSOP packages
- Designed for copper (Cu) leadframes
- Excellent under biased humidity testing
Hysol MG52F is a fast curing, high productivity molding compound, designed for high volume encapsulation of surface mount devices. MG52F is applicable for devices having chip dimensions up to 1 centimeter (400 mils) square. Various versions are available including MG52F-99B NXP which is designed to provide greatly improved moisture performance after preconditioning. It can be applied using both conventional and automold equipment.
Hysol MG52F was designed for and passed qualification testing on SOIC, PLCC, QFP, PDIP, 28, 48 and 56 pin TSSOP packages and has been used in production for more than 20 years. These packages had a copper leadframe with palladium plating. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on copper based, palladium-plated leadframes. Hysol MG52F meets UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness.
Hysol MG52F offers high adhesion to a wide range of substrates including Nickel and Palladium, low stress, a large operating window and molds with very low wire sweep.
| Color |
|Filler Content||78.8 %|
| Specific Gravity |
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
|Spiral Flow @ 175°C||76 cm|
|Moisture absorption||0.57 %|
| Volume Resistivity |
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
|Molded Shrinkage||0.3 %|
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
| Thermal Conductivity |
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
| UL 94 Rating |
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.
HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
|Transfer Pressure||40 - 100 kg/cm2|
|Transfer Time||15 - 25 s|
Hysol MG52F has excellent reliability and HTRB data and has successfully passed the following reliability tests:
- Operating Life Static Test, 125° C, 5.5V 1000 Hours: Passed
- Biased Humidity, 85° C / 85% R H, 1000 Hours: Passed
- Autoclave, 121° C, 15 psi, 240 Hours: Passed
- Temperature Cycle Test, -65° C to 150° C, 1000 Cycles: Passed
- Storage Life Test, 150° C, 1000 Hours: Passed
- Thermal Shock Test, -55° C to 125° C, 500 Cycles: Passed
- Solder Heat, 260° C, 10 Sec, 1 Cycle: Passed
- Lead Pull to Destruction: Passed
- X-Ray: Passed