JNC PA-1210-034 | Insulating Polyacrylate Ink

Main features
  • UV Curable/ Solvent free
  • High Insulation reliability for fine pitch devices
  • Advance Sensors

Product Description

PA-1210-034 is a UV-curable, solvent-free polyacrylate insulating in, sets a new benchmark for high insulating reliability in fine pitch devices. Its specialized polyacrylate composition offers robust dielectric properties, creating an insulating layer that guarantees the utmost in reliability. Its tensile modulus of 1600 MPa, this ink augments mechanical stability, making it an excellent choice for applications requiring both electrical insulation and structural integrity. Also features a residual stress of 14 MPa and a coefficient of thermal expansion (CTE) of 91 ppm/K, ensuring compatibility with diverse materials and minimizing the risk of performance-altering mismatches.

Industry Applications:

Fine Pitch Electronics | Microfabrication| Advance Sensors

Product Family
1 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
Process Method Inkjet
Solids 100 %
Physical Properties
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
35 mPa.s
Chemical Properties
Water Absorption 0.4 %
Electrical Properties
Breakdown Voltage
Breakdown Voltage
Breakdown voltage is the minimum voltage necessary to force an insulator to conduct some amount of electricity.
It is the point at which a material ceases to be an insulator and becomes a resistor that  conducts electricity at some proportion of the total current. 

After dielectric breakdown, the material may or may not behave as an insulator any more because of the molecular structure alteration. The current flow tend to create a localised puncture that totally alters the dielectric properties of the material.

This electrical property is thickness dependent and is the maximum amount of voltage that a dielectric material can withstand before breaking down. The breakdown voltage is calculated by multiplying the dielectric strength of the material times the thickness of the film.
80 V
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.0x1015 Ohms⋅cm
Mechanical Properties
Elongation is the process of lengthening something.

It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.

It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
4 %
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
91 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
136 °C

Additional Information

Properties PA-1210-034
Solids content (wt. %) 100
Viscosity (mPa's) @25℃ 35
Surface tension (mN/m) @23℃ 31
Printing methods Inkjet
Curing 2,000mJ/cm2
 @ 365nm
Post-curing 175℃
Volume resistivity (Ω*cm) 1E+15
Breakdown voltage (V/um) 80
Dielectric constant (1kHz) @1V 3.1
Tensile modulus (MPa) 1600
Elongation (%) 4
Residual stress (MPa) 14
5% weight loss temp (℃) 295
CTE ( 91
Tg (℃) 136
Water absorbance (%) @23℃ 0.4