JNC PI-6322-001 | Insulating Polyimide Ink

Harmonization Code : 3908900090 | Polyamides in Primary form

JNC PI-6322-001 | Insulating Polyimide Ink

Main features

Thermal Curable
Heat Resistance
Low Temperature Curing

Product Description

PI-6322-001 is a polyimide insulating ink designed to provide thermally curable solution to heat resistance and electrical insulation. It is engineered to provide electrical insulation with its advanced polyimide formulation ensures that your components remain safeguarded against electrical currents, allowing your devices to perform flawlessly even in high-voltage applications. Featured with only 1% water absorbance, this ink stands strong against moisture-induced vulnerabilities, guaranteeing consistent performance even in humid environments. Moreover, with a tensile modulus of 1500 MPa, this ink enhances mechanical stability, making it an excellent choice for applications requiring both electrical insulation and structural integrity.

Industry Applications:

Aerospace and Defense| Electronics Manufacturing | Industrial Sensors

Specifications
Additional Information

Technical Specifications

General Properties

Process Method

Inkjet

Solids

24 %

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

11 mPa.s

Chemical Properties

Water Absorption

1 %

Electrical Properties

Breakdown Voltage

Breakdown Voltage
Breakdown voltage is the minimum voltage necessary to force an insulator to conduct some amount of electricity.
It is the point at which a material ceases to be an insulator and becomes a resistor that conducts electricity at some proportion of the total current.

After dielectric breakdown, the material may or may not behave as an insulator any more because of the molecular structure alteration. The current flow tend to create a localised puncture that totally alters the dielectric properties of the material.

This electrical property is thickness dependent and is the maximum amount of voltage that a dielectric material can withstand before breaking down. The breakdown voltage is calculated by multiplying the dielectric strength of the material times the thickness of the film.

100 V

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

1.0x10¹⁶ Ohms⋅cm

Mechanical Properties

Elongation

Elongation
Elongation is the process of lengthening something.

It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.

It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.

6 %

Thermal Properties

Coefficient of Thermal Expansion (CTE)

Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.

Coefficient of Thermal Expansion (CTE), α1

Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.

75 ppm/°C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

250 °C

Additional Information

Properties	PI-6322-001
Solids content (wt. %)	24
Viscosity (mPa's) @25℃	11
Surface tension (mN/m) @23℃	28
Printing methods	Inkjet
Curing	180℃ 120min
Post-curing	-
Volume resistivity (Ω*cm)	1E+16
Breakdown voltage (V/um)	100
Dielectric constant (1kHz) @1V	3.8
Tensile modulus (MPa)	1500
Elongation (%)	6
Residual stress (MPa)	14
5% weight loss temp (℃)	370
CTE (	75
Tg (℃)	250
Water absorbance (%) @23℃	1.0