LINQALLOY SW-SAC305 | Solder Wire

Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • Leadfree Solder Wire
  • Lowest cost Sn/Ag/Cu Alloy
  • Excellent Fatigue Resistance

Product Description

LINQALLOY SW-SAC305 solder wire is a lead-free Tin/Silver/Copper alloy that contains 96.5% Tin (Sn), 3% Silver (Ag), and 0.5% Copper (Cu) and is often written as Sn96.5Ag3.0Cu0.5. SAC305 Solder Wire is the least expensive of the two industry standard lead-free solder wires (the other being SAC405) and is used by companies working with BGA, CSP, LBGA, PBGA and CBGA components who have made the transition to Lead-free (Pb-free) soldering.

LINQALLOY SW-SAC305 solder wire presents a highly reliable solution for various soldering applications, leveraging its superior composition and performance characteristics. Comprising 96.5% tin, 3% silver, and 0.5% copper, this solder wire offers a balanced blend of properties optimized for exceptional solder joint integrity and longevity.

With a melting temperature of approximately 217-220°C, SAC305 solder wire ensures efficient and precise soldering operations across a wide range of electronic assembly processes. Its carefully engineered formulation promotes excellent wetting and flow properties, facilitating uniform solder joint formation and minimizing the risk of solder defects such as voiding and bridging.


  • Lowest Cost Sn/Ag/Cu Alloy
  • Excellent Fatigue Resistance
  • Compatible with all Flux Types
  • Excellent Solder Joint Reliability
  • Best Wetting Sn/Ag/Cu Alloy
Product Family

Catalog Product

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Technical Specifications

General Properties
Alloy Composition
Alloy Composition
Composition of the alloy material
Alloy Type
Alloy Type
A metallic element type
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Metal Loading
Copper (Cu)
Copper (Cu)
Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity.
0.5 %
Silver (Ag) 3.0 %
Tin (Sn) 96.5 %
Thermal Properties
Melting Temperature
Eutectic Melting Temperature
Eutectic Melting Temperature
Eutectic melting temperature is the precise temperature point at which an alloy turns from pure solid to liquid.

Eutectic alloys are unique. They do not have a Solidus / Liquidus melting range but they have a single temperature point at which the alloy immediately becomes liquid and vice versa.
N/A °C
Liquidus Melting Temperature
Liquidus Melting Temperature
Liquidus, is the temperature point at which an alloy becomes completely liquid.
221 °C
Solidus Melting Temperature
Solidus Melting Temperature
Solidus is the temperature point at which a completely solid alloy starts melting and becoming softer.
217 °C
Other Properties
RoHS Compliant
RoHS Compliant
RoHS is a product level compliance based on a European Union Directive which restricts the Use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).

Products compliant with this directive do not exceed the allowable amounts of the following restricted materials: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), with some limited exemptions

Additional Information

Each spool has a clear label on the lid specifying the solder wire diameter as well as a label on the front identifying the alloy type, the date of manufacture, and the product lot (or batch) number. This batch number is also tied to a certificate of conformance that is also provided with the solder wires and ensures the SAC305 solder wires meet the following quality criteria:

  • Tin (Sn): 96.5%
  • Silver (Ag): 3%
  • Copper (Cu): 0.5%
  • Melting Temperature (Solidus): 217°C
  • Melting Temperature (Liquidus): 219°C
  • Spheroid Tolerance : Within 1.5%