LINQBOND UF-1170 | Liquid Epoxy Underfill for BGA/CSP

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LINQBOND UF1170 | Liquid Epoxy Underfill

Main features

Single component
Excellent heat and moisture resistance
Automotive grade

Product Description

LINQBOND UF-1170 is a one-component epoxy adhesive with exceptional heat resistance, dielectric properties, and electrical insulation, making UF1170 ideal for demanding underfill applications in semiconductor packaging, BGA/CSP solder joints, high-temperature electronic devices, automotive electronics, and 5G equipment.

LINQBOND UF-1170 offers robust protection against mechanical stress, moisture, and thermal cycling, ensuring long-term reliability and durability.

Cure Conditions

30 mins @150℃

Applications

Underfill for BGA/CSP solder joints
Semiconductor packaging and encapsulation
Automotive electronic modules
High-performance electronics and 5G equipment
Assemblies exposed to high temperature or thermal cycling

Specifications
Additional Information

Technical Specifications

General Properties

Appearance

Appearance
Appearance at room temperature.

Liquid

Color

Color
The color

Black

Physical Properties

Thixotropic index

Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.

0.7

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

10,000 mPa.s

Chemical Properties

Water Absorption

0.4 %

Electrical Properties

Dielectric Strength

Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.

Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.

As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.

24 kV/mm

Surface Resistivity

3.7e13 Ohms/sq

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

2.5x10¹⁵ Ohms⋅cm

Mechanical Properties

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D)	91

Storage (DMA) Modulus
Storage (DMA) Modulus @ 25°C	5,000 N/mm2

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	31 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	105 ppm/°C

Degradation temperature

Degradation temperature
The temperature at which the materials start losing their properties

366 °C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

190 °C

Additional Information

Thawing & Usage

Thaw material at room temperature (14–34 °C) for 1–2 hours before use. Do not open the container until it reaches room temperature to avoid condensation.
Keep the container upright during thawing; do not re-freeze.
Use within 2 days after opening.
Preheating the PCB to 70–80 °C can enhance flowability.

Flow conditions

FR4(Substrate)+Glass, Gap100μm

Flow conditions of UF1170 on FR4 + Glass substrate