LINQSOL EMC-1533 | Black Epoxy Molding Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LINQSOL EMC-1533 | Black Epoxy Molding Compound

Main features

Green molding compound
Designed for transistor outline (TO) and double decawatt (D2PAK) packages
Excellent workability, low water absorption, low modulus, and excellent thermal stability

Product Description

LINQSOL™ EMC-1533 is a halogen-free epoxy molding compound tailored for transistor Outline (TO) and D²PAK devices. Its low modulus minimizes package stress while maintaining a high glass-transition temperature of 170 °C for thermal stability. Its excellent flow characteristics enable smooth transfer molding. The compound also meets UL 94 V-0 flammability, ensuring robust safety margins. EMC-1533 boasts of its cost effectiveness and excellent workability with more than 500 continuous mold shots.

LINQSOL™ EMC-1533 guarantees strong performance and outstanding long-term reliability in demanding environments. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOL™ EMC-1533 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

LINQSOL™ EMC-1533 is available in pressed pellets in a wide range of sizes to meet specific customer needs. Contact us for more product information, custom sizes, or other specific requirements.

Key Features

Low Modulus, Low Stress: Reduces package warpage and wire-bond strain during thermal cycling.
High Tg 170 °C: Maintains mechanical strength at elevated junction temperatures.
Excellent Flowability: Fast 20 s gel time @ 175 °C supports high-yield transfer molding.
UL 94 V-0 Flame Rating: Ensures self-extinguishing behavior for consumer and industrial safety.
Halogen-Free & RoHS/REACH-Compliant: Avoids regulated substances for global market acceptance.
Proven Reliability: Passes 500 h HTRB, 98 h PCT and 500 thermal cycles for long-term durability.

Designed for

TO-220 (single & multi-lead power transistors, IGBTs)
TO-252 / DPAK (surface-mount MOSFETs, regulators)
TO-263 / D²PAK (high-current MOSFETs, Schottky diodes)
TO-247 (high-voltage discrete devices, rectifiers)

Reliability Tests Passed

HTRB, Tₐ=125°C, V=80%VR * 500 hour
PCT, Tₐ=121°C, P=0.215atm, RH=100%* 98 hours
Thermal Cycling Test, -55°C - +150°C * 500 cycles

LINQSOL™ EMC-1533 closely matches Hysol GR300, which shares a 170 °C Tg, 125 MPa flexural strength, and similar flow/gel characteristics, making it a practical drop-in alternative.

Specifications
Additional Information

Technical Specifications

General Properties

Filler Content

80 %

Filler Size Cut

75 µm

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.9

Physical Properties

Spiral Flow @ 175°C

68 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	10 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	8 ppm

Moisture absorption

0.4 %

Electrical Properties

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
Conductivity	0.03 mmhos/cm

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

7.5x10¹⁶ Ohms⋅cm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	17000 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	125 N/mm2

Molded Shrinkage

0.33 %

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
pH of extract	5.7

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	15 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	60 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	20 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

170 °C

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Additional Information

Recommended Mold Parameters

Parameter	Value	Unit
Molding temperature	170–190	°C
Transfer pressure	40–90	kg/cm³
Transfer time	10–25	sec
Cure time at 175 °C	1.5–2	min
Post mold cure time at 175 °C	6-12	h
Post mold cure time at 190 °C	4-6	h

To achieve the best results, test the recommended conditions on the mold. Users should conduct their own testing to ensure it meets their specific needs and application.

Processing Instructions

Before use, let LINQSOL EMC-1533 reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
Use the materials within 72 hours after removing the container from cold storage.

Storage and Handling

LINQSOL EMC-1533 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life at 5 °C is 183 days.