- Home
- Products
- Molding Compounds
- Semiconductor Epoxy Mold Compounds
- LINQSOL EMC-G375 | Thermally Conductive Mold Compound
LINQSOL EMC-G375 | Thermally Conductive Mold Compound
- Thermally conductive molding compound
- Designed for fullpack TO power packages and bridge rectifier packages
- Excellent mechanical integrity
Product Description
LINQSOL™ EMC-G375 is a high-performance, thermally conductive epoxy molding compound tailored for TO-3P, TO-220, TO-126, bridge rectifier, and other high-power semiconductor packages. With a thermal conductivity of up to 3.3 W/m·K, it effectively dissipates heat, ensuring device stability and extended service life. Its high filler loading (85%) provides superior mechanical integrity with minimal shrinkage and a flexural modulus of 25.5 GPa.
LINQSOL™ EMC-G375 also features a high glass transition temperature (175 °C) and excellent moisture resistance (≤0.2% absorption), guaranteeing long-term reliability in demanding environments. Fully compliant with RoHS and REACH, EMC-G375 offers a robust and environmentally responsible solution for next-generation power electronics.
Overall, LINQSOL™ EMC-G375 seamlessly integrates advanced material properties, safety compliance, and superior performance, precisely meeting the stringent demands of high-power semiconductor components such as TO packages..
Key Features:
- High Thermal Conductivity: Up to 3.3 W/m·K for efficient heat dissipation in power devices
- High Glass Transition Temperature: Tg of 175 °C ensures thermal stability under load
- Superior Mechanical Strength: Flexural modulus of 25.5 GPa minimizes warpage and maintains integrity
- Moisture Resistance: ≤0.2% absorption ensures reliability under humid and high-temperature conditions
- Environmental Compliance: Halogen-free, RoHS & REACH compliant for global acceptance
- Excellent Processability: Consistent spiral flow and low shrinkage for stable molding performance
Application:/ Suitable For:SiC MOSFETs; TO-package Devices, IGBT Modules
- TO-220, TO-3P, TO-126 full-pack power packages
- Bridge rectifier packages
- High-power discrete semiconductors
- Automotive and industrial power modules requiring high thermal management
- Devices in demanding environments requiring high Tg and mechanical strength
Technical Specifications
| General Properties | |||||||||
| Color Color The color | Black | ||||||||
| Filler Content | 85 % | ||||||||
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 2.7 | ||||||||
| |||||||||
| Thermal Properties | |||||||||
| Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 175 °C | ||||||||
| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 3.3 W/m.K | ||||||||
| UL 94 Rating UL 94 Rating Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole | V-0 | ||||||||
| |||||||||
| |||||||||
| Electrical Properties | |||||||||
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 3.0x1015 Ohms⋅cm | ||||||||
| |||||||||
| |||||||||
| Chemical Properties | |||||||||
| Moisture absorption | 0.2 % | ||||||||
| |||||||||
| Physical Properties | |||||||||
| Spiral Flow @ 175°C | 85 cm | ||||||||
| Mechanical Properties | |||||||||
| Molded Shrinkage | 0.003 % | ||||||||
| |||||||||
| |||||||||
| |||||||||
| Curing Conditions | |||||||||
| Transfer Pressure | 40-100 kg/cm2 | ||||||||
| Transfer Time | 10-35 s | ||||||||
| |||||||||
| |||||||||
Additional Information
EMC-G375 Recommended Mold Parameters
| Parameters | Value | Unit |
| Preheating Temperature | 75-95 | °C |
| Molding Temperature | 170-190 | °C |
| Transfer Pressure | 40-100 | kgf/cm2 |
| Transfer Time | 10-35 | s |
| Cure Time | 120-270 | s |
| Post Mold Cure Time | 4-6 | h |
Processing Instructions
- Before use, let LINQSOL™ EMC-G375 reach room temperature (23 ±5 °C) for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
- Use the materials within 48 hours after removing the product from cold storage.
- When storing unused materials, vacuum seal the product in 2 layers of PE bags packaged in moisture barrier bag and store them in a < 10 °C environment. When using the materials again, use it within 48 hours after removing the product from cold storage.
LINQSOL™ EMC-G375 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 10 °C is 183 days.
The technical information presented in this document is provided for reference only and does not constitute a guarantee of specific properties or performance. Actual results may vary depending on individual conditions and application methods. Users are strongly advised to perform their own testing and validation to determine suitability for their intended use and compliance with relevant regulations.
