LOCTITE ABLESTIK 2000B
- Pb free applications
- High hot/wet adhesion
- Ultra low moisture absorption
LOCTITE® ABLESTIK 2000B electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
LOCTITE® ABLESTIK 2000B is a low stress, silver filled hybrid that cures fast with no voids and with minimal resin bleed. It is a die attach material with an ultra low moisture absorption. This is mostly used in Asian regions while LOCTITE ABLESTIK 2100A is the most common choice for the EMEA region.
- 30 minute ramp to 175°C + 15 minutes @ 175°C
| Work life @25°C |
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
| Thixotropic index |
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.
A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.
It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
| Viscosity |
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
|Moisture absorption||0.21 %|
| Volume Resistivity |
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
| Thermal Conductivity |
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Loctite Ablestik 2100A is a product that is an almost direct alternative to Loctite Ablestik 2000B.
Loctite Ablestik 2000B is also a conductive die attach for laminates that it is mainly used in Asian regions. For EMEA we have successfully used 2100A as a drop in for use in BGA laminate applications with great success rates.
Ablestik 2100A DSC Curve - Heat flow vs temperature
Notice how the Onset of cure (minimum cure temperature) is about 70°C. Even though we suggest curing at 175°C, as with all products you can adjust the cure schedule (with a lot of trial, error and personal work) according to your final application properties.
The volume resistivity may be reduced when curing below 175°C (compared to the TDS value), but we expect that some conductivity will be developed.