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LOCTITE ABLEBOND 2030SC die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimise stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes and can be used for most metalic key substrates.
LOCTITE ABLEBOND 2030SC is a Snap curable adhesive with a proprietary hybrid chemistry that has various cure schedules and can cure very fast. One recommended cure schedule is 10 sec @ 150°C.