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LOCTITE ABLEBOND 2030SC die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes
LOCTITE ABLEBOND 2030SC as a Snap curable adhesive has various cure schedules and can cure very fast. One recommended cure schedule is 10 sec @ 150°C.