Product Description
LOCTITE ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices and printed circuits onto heat sinks in applications where electrical insulation is not required. By leveraging a precise heat and pressure process it achieves a void free connection.
LOCTITE ABLESTIK 5025E passes NASA outgassing standards. It is available in die cut preforms or sheet stock and is only available with 5011 certification.
Cure Schedule
- 30 minutes @ 150°C
- 2 hours @ 125°C