LOCTITE ABLESTIK 5025E

Harmonization Code : 3920.99.28.90 | Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other

Main features

Thin, uniform bondline control
Electrically conductive in x,y,z axes
Excellent electrical and thermal conductivity

Product Description

LOCTITE ABLESTIK 5025E unsupported, epoxy assemly adhesive film is ideal for bonding "hot" devices and printed circuits onto heat sinks in applications where electrical insulation is not required. By leveraging a precise heat and pressure process it achieves a void free connection.

LOCTITE ABLESTIK 5025E passes NASA outgassing standards. It is available in die cut preforms or sheet stock and is only available with 5011 certification.

Cure Schedule

30 minutes @ 150°C
2 hours @ 125°C

Product Family
5025E

1. Select Package Type

5×6 inch - 4 mil sheet 4 x 6 inch - 3mil 10 x 12inch - 2mil 10 x 12 inch - 4mil 10 x 12inch - 6mil

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Outgassing
CVCM CVCM Collected Volatile Condensable Materials	0.06 %
TML TML Total Mass Loss	0.3 %

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days

Work life @25°C

Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.

2184 hours

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	50 ppm
Potassium (K+) Potassium (K+) The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)	5 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	30 ppm

Mechanical Properties

Shear strength
Shear Strength @25°C	31.7 N/mm2

Tensile Modulus Tensile Modulus Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading. It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed. Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @-65°C	5,400 N/mm2
Tensile Modulus @150°C	49 N/mm2
Tensile Modulus @25°C	3,700 N/mm2
Tensile Modulus @250°C	28 N/mm2

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

5.0x10^-4 Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	65 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	150 ppm/°C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

90 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

6.5 W/m.K

Additional Information

Directions for use

LOCTITE ABLESTIK 5025E adhesive film is unsupported.
Handle carefully to avoid any stretching or flexing when frozen.
It may be helpful during handling to keep at least one sheet of release paper attached.
Preheat surface to be bonded to approximately 45°C.
Remove release paper from one side of the adhesive film.
Apply film to one of the bonding surfaces.
Remove any trapped air by pressing on the surface
Allow device to cool to room temperature.
Remove the release paper from the other side of the adhesive film. Attach the remaining adherent.
Apply spring loaded clamp or dead weight to provide continuous pressure of at least 2 to 10 psi during cure cycle.
Place assembly in a preheated oven and cure at the recommended cure schedule.