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LOCTITE ABLESTIK 5025E unsupported, epoxy assemly adhesive film is ideal for bonding "hot" devices and printed circuits onto heat sinks in applications where electrical insulation is not required. By leveraging a precise heat and pressure process it achieves a void free connection.
LOCTITE ABLESTIK 5025E passes NASA outgassing standards. It is available in die cut preforms or sheet stock and is only available with 5011 certification.
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