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LOCTITE ABLESTIK 561

Harmonization Code : 3920.99.28.90 |   Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
  • Amber epoxy film
  • Flexible & Reworkable
  • Thermally conductive

Product Description

LOCTITE ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. This thermally conductive epoxy film is typically used for Assembly applications.

LOCTITE ABLESTIK 561 is reworkable, meaning that components glued with this adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive is also available in a low temperature cure version.

 

Cure Schedule

  • 30min @150°C
  • 2 hours @ 125°C
Product Family
561  
0.10
1.65 x 0.59 inch inch sheet 1.68 x 0.93 inch sheet

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 365 days
Electrical Properties
Dielectric Constant
Dielectric Constant
Dielectric Constant (k), commonly known as relative permittivity, is a number relating the ability of a material to carry alternating current to the ability of vacuum to carry alternating current.

It determines the ability of an insulator to store electrical energy and is the ratio of electric permeability in vacuum against the electric permeability of a material.

The lower the dielectric constant (κ) and dissipation factor, the less energy is absorbed from an electric field, making it a much better insulator.

It is a dimensionless property that can be affected by various factors such as the
thickness uniformity of a material, insufficient contact between the sample and electrodes, water adsorption and contact resistance.
Dielectric Constant @ 1000 kHz 7
Dielectric Strength
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.

Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.

As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
 39370 kV/mm
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 5.0x1012 Ohms⋅cm
Dissipation Factor
Dissipation Factor
Dissipation factor is commonly known as loss tangent or tan delta.



It is a ratio of the loss index and the relative permittivity and it measures the inefficiency of an insulating material to maintain energy (that otherwise dissipates in the form of heat). The lower the factor, the better the insulation.

It is the reciprocal of the quality factor and always refers to a specific temperature and frequency.
Dissipation Factor @ 23°C /1 kHz 0.17
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 85 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 300 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 50 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 0.3 W/m.K

Additional Information