Product Description
LOCTITE ABLESTIK 561K is a white epoxy film designed for substrate attach and heat sink bonding. This adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. All data and results will vary with different thicknesses.
LOCTITE ABLESTIK 561K is a reworkable assembly film that passes NASA outgassing standards. If you require a low temperature cure you can consider LOCTITE ABLESTIK 566K. It is mainly used for substrate attach and heat sink bonding and has a glass fabric carrier.
Cure Schedule
- 30min @150°C
- 2 hours @ 125°C