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LOCTITE® ABLESTIK 8390 die attach adhesive has been formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8 x 8 mm and is suitable for used with Palladium and Ag plated substrates.
LOCTITE® ABLESTIK 8390 is an electrically and thermally conductive epoxy adhesive that manages to offer minimal resin bleed and low condensable volatiles. It has excellent dispensability, minimal tailing and stringing and can snap cure in an in line oven .