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LOCTITE® ABLESTIK 8600 die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material is not recommended for high density matrix leadframes with greater than 500 pads.
LOCTITE® ABLESTIK 8600 is a snap curable, acrylate die attach adhesive that is electrically and thermally conductive. It exhibits low bleed and improved JEDEC performance and is compatible with Ag, PPF and CU sbstrates. Typically used for small SO and QFN package types.
Snap Cure Schedule (7 Zone)