Main features
  • Two components
  • Low temperature cure
  • Dispense and Screen print

Product Description

LOCTITE ABLESTIK 967-1 die attach adhesive is  is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing, or hand probe.

LOCTITE ABLESTIK 967-1 is an electrically conductive epoxy adhesive which reduces the risk to delicate components and increases manufacturing through-put with its quick, low temperature cure.

LOCTITE ABLESTIK 967-1 has an average and maximum silver particle size of 8 µm and 25 µm respectively. 967-1 was developed as a direct replacement for H20S and it has replaced it for many customers including defense and aerospace applications (NASA outgassing approved when cured for 2hrs at 100C).

Cure Schedule

  • 6 hours @ 65°C
  • 2 hours @ 80°C
  • 30 minutes @ 120°C
  • 15 minutes @ 150°C
Product Family
EFD Syringe
3 cc 5 cc 10 cc

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
No longer available No longer available Shipping in 12 weeks

Technical Specifications

General Properties
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Type Heat Cure
Collected Volatile Condensable Materials
0.01 %
Total Mass Loss
0.54 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 365 days
Physical Properties
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
14,000 mPa.s
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
75 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
- ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
5 ppm
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.5x10-2 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
68 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
213 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
75 °C

Additional Information

What is an acceptable viscosity change for die-attach dispensing?

Typically, we reckon that 25% change in viscosity is acceptable for die attach dispense processes. Based on this, 967-1 should be good for at least 8 hours (at 25°C). Please check the Technical documents section for more dispensing and pot life information.




The Tg and modulus will increase as the cure temperature is increased. Tg & modulus are determined mainly by the organic (resin) properties.

The CTE should not change much if the cure temperature is increased. The CTE is determined mainly by the filler & filler content.