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LOCTITE ABLESTIK ABP 8068TA is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. This material’s epoxy assisted sintering formulation is designed to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages. . LOCTITE ABLESTIK ABP 8068TA has a thermal performance that is comparable to a solder paste material. In conventional box oven curing, it will cure at 1 hour at 200ºC or 175ºC. This silver filled conductive adhesive is printable and dispensable with excellent workability. It offers good sintering properties when used on Ag, PPF, Au and Cu substrates with a high thermal stability. Its high reliability make it a good solder replacement candidate and is typically used for packages such as QFN, LGA and HBLED.
How would this perform for GaN on SiC to Au plated Cu?
Silicon Nitride is an alternative to Silicon. The wafer / chip is normally fabricated from Silicon Nitride. This is mechanically fairly similar to silicon (it’s a bit harder & more brittle), so die attach that works with silicon is typically good on SiN.
GaN (Gallium Nitride) is a semiconductor layer that is grown on top of a silicon or SiN wafer / chip surface. So for die attach it is similar to attaching a Si or SiN chip.
8068TA is a “semi-sinter” material. It needs a layer of Ag or Au on both the chip & the substrate to give a good bond. An SiC wafer should have a metal back side metallization (BSM) like Ag or Au and this is the surface to sinter to. Bare Cu can also be OK for some “non-critical” applications, but it is not recommended.
For die size <5 x 5 mm
For die size >5 x 5 mm
Alternate Cure Schedule
Suitable for Ag, Au and PPF substrates