Product Description
LOCTITE ABLESTIK ABP 8068TA is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. This material’s epoxy assisted sintering formulation is designed to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages. .
LOCTITE ABLESTIK ABP 8068TA has a thermal performance that is comparable to a solder paste material. In conventional box oven curing, it will cure at 1 hour at 200ºC or 175ºC. This silver filled conductive adhesive is printable and dispensable with excellent workability. It offers good sintering properties when used on Ag, PPF, Au and Cu substrates with a high thermal stability. Its high reliability make it a good solder replacement candidate and is typically used for packages such as QFN, LGA and HBLED.