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Harmonization Code : 3920.99.28.90 |   Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
  • Non conductive
  • Thin bondline
  • Fast cure

Product Description

LOCTITE® ABLESTIK ATB 120U Non conductive adhesive film is formulated for use in wafer lamination and chip on chip processes. It combines process ease with the proven reliability of Henkel materials. It is the most transparent film available for high volume applications and is widely used for glass attach in smart phones (bonding the finger print sensor “under glass”).This 2 in 1 format is designed for base die and die to die (>1x1mm) applications, moving to thing wafer (<100um). It is a product with good workability, excellent flow ability on the substrate and a good candidate when using a Si spacer die for CoC processes.

LOCTITE® ABLESTIK ATB 120U Non conductive adhesive film has a thickness of 20um but is also available in 10, 30 and 40um. It can be used to absorb CTE mismatch between substrates but the extend to which it can be effective will depend on the bond area. The bigger the parts, the bigger the mismatch and stress. Even flexible adhesives won’t behave that flexible when thin bond lines need to absorb stress in larger bond areas. For example the glass wind shield in cars is bonded with flexible PUR adhesive with ±2-3mm bond line thickness to absorb movements. So from a Die attach film perspective, a 20um bond line will give half the stress compared to 10um!


Cure Schedule

  • 30 minute ramp to 120°C + 30 minutes @ 120°C
Product Family
12 inch circles 8 inch circles
50 25

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Not Available Shipping in 8 - 12 weeks

Technical Specifications

General Properties
Adhesive Thickness
Adhesive Thickness
Adhesive thickness indicates the thickness of an adhesive layer.

It refers to the adhesive thickness of a single side so for double sided tapes it always needs to be multiplied.
20 µm
Film Thickness
Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.
85 µm
Total Thickness
Total Thickness
Total thickness is taking into account all the films, coatings, adhesives, release liners and special layers and is the maximum thickness of a film or tape.
105 μm
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
720 hours
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 274 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
10 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
10 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
10 ppm
Mechanical Properties
Shear strength
Shear Strength @25°C 62.72 N/mm2
Shear Strength @250°C 3.04 N/mm2
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @-65°C 2,330 N/mm2
Tensile Modulus @150°C 3 N/mm2
Tensile Modulus @25°C 875 N/mm2
Tensile Modulus @250°C 2 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
62 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
238 ppm/°C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.21 W/m.K

Additional Information

ATB 120U Transmittance vs Other films light transmittance


How do you use Die attach films?

These dicing die attach adhesive films are supplied on a wafer dicing tape, being laminated on a wafer which can be diced and then a typically dry to touch “B-staged” adhesive of 10-40um will be left of the die back (of part) before final bonding step. Todays’ thinnest version is ATB 110U with 10um adhesive layer after removing the release liner and dicing tape. Note that surface roughness and warpage needs to be compensated to prevent voids during and after cure, so 20um is more commonly used.

What Dk/Df data do we have for these materials?
We do not have dk/df for these specific thicknesses but please see data at much lower frequencies on hand attached for reference
Looking at the down trend at higher frequencies and other epoxy based materials tested, we estimate Dk ~3 for these film materials at 28 GHz ...